Measurements of sputtering yields and composition profiles have been carried out using backscattering spectrometry for samples of CrSi_2 on Si irradiated with 200‐keV Xe ions. When the CrSi_2 layer is thinner than the ion range, the sputtering yield ratio of Si to Cr increases from 3.5 for room‐temperature irradiation to 65 at 290 °C. For a thick sample, the corresponding increase is from 2.4 to 4.0. only. These changes are explained in terms of a rise in the Si surface concentration at 290 °C. The driving force for this process seems to be the establishment of stoichiometric CrSi_2 compound. Transport of Si to the surface is by ion mixing in the thin sample and thermal diffusion through the thick layer
Modifications of Cr\u2013silicide (Cr3Si and CrSi2) and Ni\u2013silicide (NiSi2) surface and subsurf...
Swift heavy ions of Au at 120 MeV are irradiated at the interface of Si/Me/Si (Me=V,Fe,Co) and the b...
Swift heavy ions of Au at 120 MeV are irradiated at the interface of Si/Me/Si (Me=V,Fe,Co) and the b...
Measurements of sputtering yields and composition profiles have been carried out using backscatterin...
The formation of CrSi_2 by ion mixing was studied as a function of temperature, silicide thickness a...
Electrical resistivity measurements are used to study damage in CrSi_2 thin films induced by Ne, Ar,...
The formation of chromium disilicide layers on n-type single crystal silicon substrates (111) during...
We have measured the kinetic rate of formation of CrSi2 using 2.0-MeV 4He + backscattering spectrome...
The changes in the morphology and the electrophysical properties of the Cr/n-Si (111) structure depe...
Atomic mixing and preferential sputtering impose a depth resolution limit on the use of sputter sect...
Atomic mixing and preferential sputtering impose a depth resolution limit on the use of sputter sect...
The mixing of Ti, Cr, and Ni thin films with SiO_2 by low‐temperature (−196–25 °C) irradiation with ...
Modifications of Cr–silicide (Cr3Si and CrSi2) and Ni–silicide (NiSi2) surface and subsurface region...
The mixing of Ti, Cr, and Ni thin films with SiO_2 by low‐temperature (−196–25 °C) irradiation with ...
In this study, the critical dose for ion-beam mixing of Co and Si with Ge ions which results in homo...
Modifications of Cr\u2013silicide (Cr3Si and CrSi2) and Ni\u2013silicide (NiSi2) surface and subsurf...
Swift heavy ions of Au at 120 MeV are irradiated at the interface of Si/Me/Si (Me=V,Fe,Co) and the b...
Swift heavy ions of Au at 120 MeV are irradiated at the interface of Si/Me/Si (Me=V,Fe,Co) and the b...
Measurements of sputtering yields and composition profiles have been carried out using backscatterin...
The formation of CrSi_2 by ion mixing was studied as a function of temperature, silicide thickness a...
Electrical resistivity measurements are used to study damage in CrSi_2 thin films induced by Ne, Ar,...
The formation of chromium disilicide layers on n-type single crystal silicon substrates (111) during...
We have measured the kinetic rate of formation of CrSi2 using 2.0-MeV 4He + backscattering spectrome...
The changes in the morphology and the electrophysical properties of the Cr/n-Si (111) structure depe...
Atomic mixing and preferential sputtering impose a depth resolution limit on the use of sputter sect...
Atomic mixing and preferential sputtering impose a depth resolution limit on the use of sputter sect...
The mixing of Ti, Cr, and Ni thin films with SiO_2 by low‐temperature (−196–25 °C) irradiation with ...
Modifications of Cr–silicide (Cr3Si and CrSi2) and Ni–silicide (NiSi2) surface and subsurface region...
The mixing of Ti, Cr, and Ni thin films with SiO_2 by low‐temperature (−196–25 °C) irradiation with ...
In this study, the critical dose for ion-beam mixing of Co and Si with Ge ions which results in homo...
Modifications of Cr\u2013silicide (Cr3Si and CrSi2) and Ni\u2013silicide (NiSi2) surface and subsurf...
Swift heavy ions of Au at 120 MeV are irradiated at the interface of Si/Me/Si (Me=V,Fe,Co) and the b...
Swift heavy ions of Au at 120 MeV are irradiated at the interface of Si/Me/Si (Me=V,Fe,Co) and the b...