Ion backscattering spectrometry has been used to investigate the depth dependence of atomic mixing induced by ion beams. Samples consisting of a thin Pt (or Si) marker a few tens of angstroms thick buried at different depths in a deposited Si (or Pt) layer were bombarded with Xe+ of 300 keV at 2×10^16 cm^–2 dose and Ar+ of 150 keV at 5×10^15cm^–2 dose. Significant spreading of the marker was observed as a result of ion irradiation. The amount of spreading was measured as a function of depth of the marker, which was then compared with the deposited energy distribution. Measurements of this kind promise new insight into the nature of the interaction between ion beams and solids
Si films with an embedded Ta marker layer are irradiated by 0.9 MeV Al atoms and 2.7 MeV Al-3 cluste...
Si films with an embedded Ta marker layer are irradiated by Al-n (n = 1, 3), Cu-n (n = 1, 2) and Ge-...
Swift heavy ions of Au at 120 MeV are irradiated at the interface of Si/Me/Si (Me=V,Fe,Co) and the b...
Ion backscattering spectrometry has been used to investigate the depth dependence of atomic mixing i...
International audienceWe present in this text a new experimental tool to study the mixing of atoms u...
Backscattering spectrometry is the microanalysis of the surface and near−surface regions of material...
We have studied the mixing of a bilayer sample interface. The AuPt bilayer was sectioned in a SIMS a...
The analysis of thin films is of central importance for functional materials, including the very lar...
The ion beam induced mixing of Au/Pt and Pt/Au multilayers in SIMS sputter depth profiling with 2.5,...
The amount of atomic mixing in amorphous SiO2 and Si is studied by measuring the redistribution of t...
Atomic mixing and preferential sputtering impose a depth resolution limit on the use of sputter sect...
When a metal target is bombarded with light ions some are implanted and some are reflected from the ...
The mixing effect of three different film/substrate systems, Ti/Al, Al/Ti and Ni/Ti, which were irra...
Ion beams of MeV energy are in routine use as depth microscopes to determine composition and impurit...
Si films with an embedded Ta marker layer are irradiated by 0.9 MeV Al atoms and 2.7 MeV Al-3 cluste...
Si films with an embedded Ta marker layer are irradiated by Al-n (n = 1, 3), Cu-n (n = 1, 2) and Ge-...
Swift heavy ions of Au at 120 MeV are irradiated at the interface of Si/Me/Si (Me=V,Fe,Co) and the b...
Ion backscattering spectrometry has been used to investigate the depth dependence of atomic mixing i...
International audienceWe present in this text a new experimental tool to study the mixing of atoms u...
Backscattering spectrometry is the microanalysis of the surface and near−surface regions of material...
We have studied the mixing of a bilayer sample interface. The AuPt bilayer was sectioned in a SIMS a...
The analysis of thin films is of central importance for functional materials, including the very lar...
The ion beam induced mixing of Au/Pt and Pt/Au multilayers in SIMS sputter depth profiling with 2.5,...
The amount of atomic mixing in amorphous SiO2 and Si is studied by measuring the redistribution of t...
Atomic mixing and preferential sputtering impose a depth resolution limit on the use of sputter sect...
When a metal target is bombarded with light ions some are implanted and some are reflected from the ...
The mixing effect of three different film/substrate systems, Ti/Al, Al/Ti and Ni/Ti, which were irra...
Ion beams of MeV energy are in routine use as depth microscopes to determine composition and impurit...
Si films with an embedded Ta marker layer are irradiated by 0.9 MeV Al atoms and 2.7 MeV Al-3 cluste...
Si films with an embedded Ta marker layer are irradiated by Al-n (n = 1, 3), Cu-n (n = 1, 2) and Ge-...
Swift heavy ions of Au at 120 MeV are irradiated at the interface of Si/Me/Si (Me=V,Fe,Co) and the b...