Formation and Stress Analysis of Through-Hole Solder Joints

Solutions for determination of equilibrium shapes of axisymmetric through-hole solder joint with parametric finite element method are obtained. The case of finite tinning on the board and infinite tinning on the pin is studied. Results are presented graphically in terms of certain dimensionless parameters including dimensionless solder volume, tinning width, and board thickness. Behavior analysis of solder joints is implemented by finite element analysis program ANSYS. The macro programs are developed to incorporate the results of the joint profile predicting program to form the solid model and implement stress/strain analysis with ANSYS code