This work presents a modeling for a heat exchanger that operates through the boiling of a working fluid, aiming to analyze the temperature distribution when used together in electronic systems, since the electronic components are getting smaller and dissipating more heat. The heat exchanger studied is known as vapor chamber. A numerical analysis using a simplified model of thermal conductivities is performed. This model is created to be used in ANSYS FLUENT® software. The vapor chamber is represented by several blocks, each with effective thermal conductivity, and the contribution of each block in the total heat transfer is investigated. Since overall thermal performance depends on the thermal conductivity of each block, an evaluation can t...