Electrical resistivity measurements and scanning electron microscopy was used to study the dissolution of silver on Cu-Ag and Cu-Al-Ag alloys. The results seem to indicate that the dissolution temperature is affected by the addition of aluminium
The influence of additions of 1.3, 2.5, 3.8, 5.1, and 6.3 at.% Ag on the aging behavior of the Cu-10...
The influence of additions of 2, 4, 6, 8, 10 and 12 mass% Ag on the thermal behavior of the Cu-8 mas...
The anodic dissolution reaction of copper in copper electro-refining was studied by considering the ...
The dissolution behavior of silver and copper from their elemental states and Ag/Cu alloys in ammoni...
As temperaturas onde ocorre a solubilização da fase rica em prata, em ligas de Cu-Al-Ag, foram deter...
The electrochemical behavior in 0.5 M H2SO4 at 25 degreesC of a Cu-Al(9.3 wt%)-Ag(4.7 wt%) alloy sub...
The effect of 4 mass% Ag addition on the thermal behavior of the Cu-9 mass% Al alloy was studied usi...
The electrochemical behaviour of Cu, Cu-Al and Cu-Al-Ag alloys in aqueous solutions of NaCl (0.5 M, ...
The influence of silver additions on the Cu-13 wt. pot. Al alloy hardness was studied for additions ...
Resistometric studies of isochronal and isothermal annealing of an Al-0.64 at.% Ag alloy have given ...
A flux of silver atoms reevaporated from the copper and nickel targets during deposition of silver w...
The kinetics of zone formation in Al-3wt% Cu-1wt% Mg alloy, with or without trace impurities like Si...
Estudou-se a influência de adições de 2, 6 e 8% Ag, em peso, na resistividade elétrica da liga Cu-5%...
Thermal behavior of alpha-(Cu-Al-Ag) alloys, i.e. alloys with composition less than about 8.5 mass% ...
The Ag precipitation and dissolution reactions in the Cu-3 wt.% Al-4 wt.% Ag alloy were studied usin...
The influence of additions of 1.3, 2.5, 3.8, 5.1, and 6.3 at.% Ag on the aging behavior of the Cu-10...
The influence of additions of 2, 4, 6, 8, 10 and 12 mass% Ag on the thermal behavior of the Cu-8 mas...
The anodic dissolution reaction of copper in copper electro-refining was studied by considering the ...
The dissolution behavior of silver and copper from their elemental states and Ag/Cu alloys in ammoni...
As temperaturas onde ocorre a solubilização da fase rica em prata, em ligas de Cu-Al-Ag, foram deter...
The electrochemical behavior in 0.5 M H2SO4 at 25 degreesC of a Cu-Al(9.3 wt%)-Ag(4.7 wt%) alloy sub...
The effect of 4 mass% Ag addition on the thermal behavior of the Cu-9 mass% Al alloy was studied usi...
The electrochemical behaviour of Cu, Cu-Al and Cu-Al-Ag alloys in aqueous solutions of NaCl (0.5 M, ...
The influence of silver additions on the Cu-13 wt. pot. Al alloy hardness was studied for additions ...
Resistometric studies of isochronal and isothermal annealing of an Al-0.64 at.% Ag alloy have given ...
A flux of silver atoms reevaporated from the copper and nickel targets during deposition of silver w...
The kinetics of zone formation in Al-3wt% Cu-1wt% Mg alloy, with or without trace impurities like Si...
Estudou-se a influência de adições de 2, 6 e 8% Ag, em peso, na resistividade elétrica da liga Cu-5%...
Thermal behavior of alpha-(Cu-Al-Ag) alloys, i.e. alloys with composition less than about 8.5 mass% ...
The Ag precipitation and dissolution reactions in the Cu-3 wt.% Al-4 wt.% Ag alloy were studied usin...
The influence of additions of 1.3, 2.5, 3.8, 5.1, and 6.3 at.% Ag on the aging behavior of the Cu-10...
The influence of additions of 2, 4, 6, 8, 10 and 12 mass% Ag on the thermal behavior of the Cu-8 mas...
The anodic dissolution reaction of copper in copper electro-refining was studied by considering the ...
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