Structure Control of Cu-Zn Microchannel Lining Layers with Electrochemical Dissolution

The effect of potentiostatic dissolution on the structure of a Cu-Zn alloy microchannel lining layer was investigated. The microchannel lining layer was fabricated by a powder-metallurgical process using copper powder and zinc wire. The lining layer became more porous after potentiostatic dissolution at a constant potential of −0.5 V vs. Ag/AgCl. The lining layer was remarkably dezinced and it contained many open pores under the dissolution condition at +0.5 V. These results indicate the possibility of precise structure control of the microchannel lining layer