Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big.LITTLE). These platforms deal with concurrently executing applications, having varying workload profiles and performance requirements. Runtime management is imperative for adapting to such performance requirements and workload variabilities and to increase energy and temperature efficiency. Temperature has also become a critical parameter since it affects reliability, power consumption, and performance and, hence, must be managed. This paper proposes an accurate temperature prediction scheme coupled with a runtime energy management approach to proactively avoid exceeding temperature thresholds while maintaining performance targets. Experimen...
The goal of thermal management is to meet maximum operating temperature constraints, while at the sa...
Constant increase in performance demands, more aggressive technology scaling and higher transistor i...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
Recently, processor power density has been increasing at an alarming rate result- ing in high on-chi...
Abstract—Multi-core System-on-Chip (SoC) has become a popular execution platform for many embedded r...
The power consumption of a high-end microprocessor increases very rapidly. High power consumption wi...
Thermal cycling as well as temperature gradient in time and space affects the lifetime reliability a...
Abstract—With the high integration density and complexity of the modern multi-core platform, thermal...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
Temperature and cooling are critical aspects of design in today's and future computing systems. High...
Modern embedded systems execute applications, which interacts with the operating system and hardware...
Thermal cycling as well as spatial and thermal gradient affects the lifetime reliability and perform...
The goal of thermal management is to meet maximum operating temperature constraints, while at the sa...
Constant increase in performance demands, more aggressive technology scaling and higher transistor i...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
Recently, processor power density has been increasing at an alarming rate result- ing in high on-chi...
Abstract—Multi-core System-on-Chip (SoC) has become a popular execution platform for many embedded r...
The power consumption of a high-end microprocessor increases very rapidly. High power consumption wi...
Thermal cycling as well as temperature gradient in time and space affects the lifetime reliability a...
Abstract—With the high integration density and complexity of the modern multi-core platform, thermal...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
Temperature and cooling are critical aspects of design in today's and future computing systems. High...
Modern embedded systems execute applications, which interacts with the operating system and hardware...
Thermal cycling as well as spatial and thermal gradient affects the lifetime reliability and perform...
The goal of thermal management is to meet maximum operating temperature constraints, while at the sa...
Constant increase in performance demands, more aggressive technology scaling and higher transistor i...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...