Fabrication of embedded-type transparent electrodes via solution process

In this study, embedded-type transparent copper (Cu) mesh electrodes for flexible applications were fabricated via solution process. The Cu layer was deposited on PET substrates using an electroless plating method and the mesh was patterned by lithography. The Cu meshes were embedded using a hot press machine by changing the pressure and press time. The embedded depth of the Cu meshes was measured by α -step. The transmittance and sheet resistance of the fabricated Cu mesh electrodes were measured using a UV-vis spectrophotometer and a non-contact sheet resistance measurement equipment, respectively, before and after hot pressing