AbstractThick silicon dioxide with good heat insulation properties can reduce the parasitic capacitance and heat conductivity in sensors and actuators. This research focuses on the evaluation of the mechanical properties of the silicon dioxide microstructure fabricated by using trench etching and oxidation process in order to use it for movable elements in MEMS devices. The elastic modulus is estimated from the resonant frequency of fabricated cantilevers. It revealed comparable values to that of bulk SiO2. Non-linear characteristics such as hardening and softening spring effects are observed dependent on the patterning direction of trench etching
To ensure chemical stability and long-term operation, organic electronic devices require encapsulati...
Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2014.Cata...
Copyright © 2014 A. Ashok and P. Pal.This is an open access article distributed under the Creative C...
Silicon dioxide is the most commonly used insulator material in IC technology and in the other field...
Silicon dioxide film can be used as components in devices such as insulator and encapsulation materi...
In this reported work, silicon dioxide (SiO2) thin films have been developed at room temperature usi...
Silicon dioxide (SiO2) thin films are most widely used insulating films in the manufacture of silico...
Abstract Silicon dioxide thin film is a common compo-nent in electronic devices and in MEMS, but its...
This work reports on studies and the fabrication process development of micromechanical silicon-on-i...
Thermally grown silicon dioxide film is an important material in integrated circuits (ICs) as gate o...
Silicon dioxide film has become one of the candidates for encapsulation layer due to its low water p...
In the microelectromechanical system (MEMS) fabrication, silicon dioxide (SiO2) thin films are most ...
This paper proposes a microfabrication process for the reliable release of SiO2 beam structures. The...
This dissertation considers dislocation creation in single crystal silicon slices due to thermal oxi...
International audienceIn this work we present our recent investigation on characterizing mechanical ...
To ensure chemical stability and long-term operation, organic electronic devices require encapsulati...
Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2014.Cata...
Copyright © 2014 A. Ashok and P. Pal.This is an open access article distributed under the Creative C...
Silicon dioxide is the most commonly used insulator material in IC technology and in the other field...
Silicon dioxide film can be used as components in devices such as insulator and encapsulation materi...
In this reported work, silicon dioxide (SiO2) thin films have been developed at room temperature usi...
Silicon dioxide (SiO2) thin films are most widely used insulating films in the manufacture of silico...
Abstract Silicon dioxide thin film is a common compo-nent in electronic devices and in MEMS, but its...
This work reports on studies and the fabrication process development of micromechanical silicon-on-i...
Thermally grown silicon dioxide film is an important material in integrated circuits (ICs) as gate o...
Silicon dioxide film has become one of the candidates for encapsulation layer due to its low water p...
In the microelectromechanical system (MEMS) fabrication, silicon dioxide (SiO2) thin films are most ...
This paper proposes a microfabrication process for the reliable release of SiO2 beam structures. The...
This dissertation considers dislocation creation in single crystal silicon slices due to thermal oxi...
International audienceIn this work we present our recent investigation on characterizing mechanical ...
To ensure chemical stability and long-term operation, organic electronic devices require encapsulati...
Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2014.Cata...
Copyright © 2014 A. Ashok and P. Pal.This is an open access article distributed under the Creative C...