AbstractNon-equilibrium solidification of undercooled metastable immiscible Cu50Co50 alloy was performed by using glass-fluxing coupled with cyclic superheating method. The evolutions of microstructure morphology and solute segregation were elucidated as a function of initial undercooling. As for the samples undercooled by 62K and 105K, α-Co dendrites form primarily from the homogeneous liquid phase and then break into granular grains during the recalescence process. Moreover, the growth of dendrite changes from the solute-controlled mode to thermal-controlled mode with increasing undercooling, which generates the reduction of trunk size and the increase of solute content. In contrast, dual-layer structure prevails for larger undercoolings,...
If a liquid is undercooled below its equilibrium melting temperature an excess Gibbs free energy is ...
International audienceRapid solidification undercooling of alloys results in microstructures with re...
In this paper, a new high strength copper based alloy (Cu-20 at%Fe-5 at% Si) in Cu-Fe-Si system is r...
The solidification behavior and solidification structure evolution of Cu-37.4wt%Pb undercooled melt ...
The solidification behavior of an atomized droplet of a metastable, immiscible Cu–Fe alloy has been ...
Cu-50 at% Co and Cu-68.5 at% Co metastable monotectic Cu–Co alloys have been rapidly solidified in a...
Taking a Cu55Ni45 alloy as experimental alloy systems, we systematically studied the method of obtai...
Liquids of silver-copper alloys with near eutectic compositions embedded in a copper matrix were und...
The solidification microstructure evolution of undercooled Cu-15 wt.% Fe alloy melt was studied in t...
Liquids of silver-copper alloys with near eutectic compositions embedded in a copper matrix were und...
Microstructure and microtexture of rapidly solidified undercooled Ni-Cu alloys were investigated. Th...
Ag–Cu alloys, as one type of typical eutectic solders, have been widely used in microelectronic pack...
Traditional recrystallization technology is based on recrystallization annealing after artificial pl...
Solidification microstructures of Cu-40 wt.% Pb alloy were examined under different undercooling deg...
Metastable monotectic Cu – 50 at. % Co alloy produced by arc melting has been processed under micro ...
If a liquid is undercooled below its equilibrium melting temperature an excess Gibbs free energy is ...
International audienceRapid solidification undercooling of alloys results in microstructures with re...
In this paper, a new high strength copper based alloy (Cu-20 at%Fe-5 at% Si) in Cu-Fe-Si system is r...
The solidification behavior and solidification structure evolution of Cu-37.4wt%Pb undercooled melt ...
The solidification behavior of an atomized droplet of a metastable, immiscible Cu–Fe alloy has been ...
Cu-50 at% Co and Cu-68.5 at% Co metastable monotectic Cu–Co alloys have been rapidly solidified in a...
Taking a Cu55Ni45 alloy as experimental alloy systems, we systematically studied the method of obtai...
Liquids of silver-copper alloys with near eutectic compositions embedded in a copper matrix were und...
The solidification microstructure evolution of undercooled Cu-15 wt.% Fe alloy melt was studied in t...
Liquids of silver-copper alloys with near eutectic compositions embedded in a copper matrix were und...
Microstructure and microtexture of rapidly solidified undercooled Ni-Cu alloys were investigated. Th...
Ag–Cu alloys, as one type of typical eutectic solders, have been widely used in microelectronic pack...
Traditional recrystallization technology is based on recrystallization annealing after artificial pl...
Solidification microstructures of Cu-40 wt.% Pb alloy were examined under different undercooling deg...
Metastable monotectic Cu – 50 at. % Co alloy produced by arc melting has been processed under micro ...
If a liquid is undercooled below its equilibrium melting temperature an excess Gibbs free energy is ...
International audienceRapid solidification undercooling of alloys results in microstructures with re...
In this paper, a new high strength copper based alloy (Cu-20 at%Fe-5 at% Si) in Cu-Fe-Si system is r...