AbstractTensile specimens of metal films on compliant substrates are widely used for determining interfacial properties. These properties are identified by the comparison of experimentally observed delamination buckling and a mathematical model which contains the interface properties as parameters. The current two-dimensional models for delamination buckling are not able to capture the complex stress and deformation states arising in the considered uniaxial tension test in a satisfying way. Therefore, three-dimensional models are developed in a multi-scale approach. It is shown that, for the considered uniaxial tension test, the buckling and associated delamination process are initiated and driven by interfacial shear in addition to compres...
textDifferent fracture modes have been observed in thin film structures. One common approach used in...
Many modern electronic devices consist of multilayered stacks of functional materials with a wide ra...
Delamination of prestressed thin films on thick substrates is analysed accounting for plastic dissip...
AbstractTensile specimens of metal films on compliant substrates are widely used for determining int...
A compression-induced buckling delamination test is employed to quantitatively characterize the inte...
A discrete lattice based model for the interaction of cracking, delamination and buckling of brittle...
A discrete lattice based model for the interaction of cracking, delamination and buckling of brittle...
Deformation and fracture of thin films on compliant substrates are key factors c...
The paper proposes a finite element systematic study of a mechanical system composed by a soft elast...
AbstractNonlinear buckling of elastic thin films on compliant substrates is studied by modeling and ...
© The Author(s) 2008. This article is published with open access at Springerlink.com Abstract A disc...
The paper proposes a finite element systematic study of a mechanical system composed by a soft elast...
textDifferent fracture modes have been observed in thin film structures. One common approach used in...
Many modern electronic devices consist of multilayered stacks of functional materials with a wide ra...
A one-dimensional delamination buckling model of a thin film was proposed for the microwedge indenta...
textDifferent fracture modes have been observed in thin film structures. One common approach used in...
Many modern electronic devices consist of multilayered stacks of functional materials with a wide ra...
Delamination of prestressed thin films on thick substrates is analysed accounting for plastic dissip...
AbstractTensile specimens of metal films on compliant substrates are widely used for determining int...
A compression-induced buckling delamination test is employed to quantitatively characterize the inte...
A discrete lattice based model for the interaction of cracking, delamination and buckling of brittle...
A discrete lattice based model for the interaction of cracking, delamination and buckling of brittle...
Deformation and fracture of thin films on compliant substrates are key factors c...
The paper proposes a finite element systematic study of a mechanical system composed by a soft elast...
AbstractNonlinear buckling of elastic thin films on compliant substrates is studied by modeling and ...
© The Author(s) 2008. This article is published with open access at Springerlink.com Abstract A disc...
The paper proposes a finite element systematic study of a mechanical system composed by a soft elast...
textDifferent fracture modes have been observed in thin film structures. One common approach used in...
Many modern electronic devices consist of multilayered stacks of functional materials with a wide ra...
A one-dimensional delamination buckling model of a thin film was proposed for the microwedge indenta...
textDifferent fracture modes have been observed in thin film structures. One common approach used in...
Many modern electronic devices consist of multilayered stacks of functional materials with a wide ra...
Delamination of prestressed thin films on thick substrates is analysed accounting for plastic dissip...