Novel chips for the communication age — Joint effort on III–V electronics a success

AbstractWith convincing solutions to realize key components of both mobile communication and mm wave sensor systems, a 5-year joint effort on III–V electronics in Germany was recently finalized. Some of the results concerted action that was funded by the Germany Federal Ministry of Education, Science, Research and Technology (BMBF) have already found commercial applications as products of the III–V semiconductor technology which is of particular importance for implementing innovative information and communication systems. As the most renowned representative of this technology GaAs forms the substrate wafer base of high-performance ICs for applications such as mobile radio, optical telecom and ultrafast digital processing with low power dissipation