AbstractAluminum film deposited on GFRP, in this paper by cathodic arc technology for decreasing the reflect wastage. The aluminum film have been characterized by pull test, Dektak 8 Stylus Profilometer, SEM, XPS, XRD and Z-82 standard four probe. The results show that the aluminum film, be compose of face centered cubic (fcc) structure, is compact, uniform. And the resistivity of film is close to bulk aluminum. The XPS spectra show that the Al-C, Al-O bonds were created in film deposition process
The chemical mechanical planarization (CMP) process is critical in fabricating ultra large scale int...
A solution dipping process consisting of 2 steps, including (i) a catalytic treatment of the substra...
In this thesis the relationship between plasma chemistry and energetics and thin film properties was...
Aluminum thin films have been investigated in an effort to relate measurable resistive and observabl...
It is presented a study conducted on the physical and electrochemical properties of fluorinated a-C:...
In this work it was investigated whether the optical density, electrical resistance and amount of al...
It is impossible to deposit aluminum from aqueous solution because hydrogen generation occur before ...
Cathodic polarization of aluminum in acid solution produces a surface film which was studied using i...
Aluminum thin films were deposited on amorphous substrates by getter sputtering. The effects of subs...
Using a filtered vacuum arc deposition device, stoichiometric aluminum oxide (Al₂O₃) films, with thi...
Arc thermal metal spray coating provides excellent corrosion, erosion and wear resistance to steel s...
Nano Al films were prepared on AZ31 magnesium alloy samples by DC magnetron sputtering. The effects ...
Characteristics of alumina films formed by the annealed aluminum films at high temperatures in ai
Thin alumina films were deposited at low temperatures (290–420°C) on stainless steel, type AISI 304....
Thin alumina films were deposited at low temperatures (290-420 °C) on stainless teel, type AISI 304....
The chemical mechanical planarization (CMP) process is critical in fabricating ultra large scale int...
A solution dipping process consisting of 2 steps, including (i) a catalytic treatment of the substra...
In this thesis the relationship between plasma chemistry and energetics and thin film properties was...
Aluminum thin films have been investigated in an effort to relate measurable resistive and observabl...
It is presented a study conducted on the physical and electrochemical properties of fluorinated a-C:...
In this work it was investigated whether the optical density, electrical resistance and amount of al...
It is impossible to deposit aluminum from aqueous solution because hydrogen generation occur before ...
Cathodic polarization of aluminum in acid solution produces a surface film which was studied using i...
Aluminum thin films were deposited on amorphous substrates by getter sputtering. The effects of subs...
Using a filtered vacuum arc deposition device, stoichiometric aluminum oxide (Al₂O₃) films, with thi...
Arc thermal metal spray coating provides excellent corrosion, erosion and wear resistance to steel s...
Nano Al films were prepared on AZ31 magnesium alloy samples by DC magnetron sputtering. The effects ...
Characteristics of alumina films formed by the annealed aluminum films at high temperatures in ai
Thin alumina films were deposited at low temperatures (290–420°C) on stainless steel, type AISI 304....
Thin alumina films were deposited at low temperatures (290-420 °C) on stainless teel, type AISI 304....
The chemical mechanical planarization (CMP) process is critical in fabricating ultra large scale int...
A solution dipping process consisting of 2 steps, including (i) a catalytic treatment of the substra...
In this thesis the relationship between plasma chemistry and energetics and thin film properties was...