AbstractLasers as production tools offer several advantages, which are especially relevant for the production of solar cells. The contact-less and localized nature of the energy deposition allows new processes, such as laser selective emitter doping, laser ablation of dielectric coatings and via drilling for back contact cell concepts. A highly critical factor is the correct selection of laser parameters and thus laser sources in a manner that adapts the laser process to the requirements of the material, the process nature and the solar cell properties. In this paper the influence of the pulse duration in the range from hundreds of femtoseconds to ten picoseconds on the selective ablation of silicon nitride from multi-crytsalline solar cell...
Laser microstructuring of thin dielectric layers on sensitive electronic devices, such as crystallin...
To increase the conversion efficiency of silicon solar cells the creation of selective emitters is s...
The removal of a 75- to 90-nm-thick passivating silicon nitride antireflection coating from standard...
Lasers as production tools offer several advantages, which are especially relevant for the productio...
Laser ablation of passivation layers is one of the most promising processes for high efficiency cell...
AbstractLasers as production tools offer several advantages, which are especially relevant for the p...
Lasers as production tools offer several advantages, which are especially relevant for the productio...
AbstractIn the production process of microelectronic devices and high efficiency solar cells, local ...
Ultra short pulse laser ablation is used to open the SiN passivation layer locally. The influence of...
AbstractIn this work SiNX deposited on silicon was locally ablated using laser irradiation. The focu...
A wide range laser pulse duration experiment is carried out including pulse durations from 250 femto...
In the production process of silicon microelectronic devices and high efficiency silicon solar cells...
Present PhD thesis is the experimental and theoretical analysis of thin layer ultrashort pulsed lase...
In order to cut and decollate silicon for the manufacturing of solar cells and electronic components...
AbstractSelective laser ablation of silicon nitride (SiNx) layers is a crucial technological step to...
Laser microstructuring of thin dielectric layers on sensitive electronic devices, such as crystallin...
To increase the conversion efficiency of silicon solar cells the creation of selective emitters is s...
The removal of a 75- to 90-nm-thick passivating silicon nitride antireflection coating from standard...
Lasers as production tools offer several advantages, which are especially relevant for the productio...
Laser ablation of passivation layers is one of the most promising processes for high efficiency cell...
AbstractLasers as production tools offer several advantages, which are especially relevant for the p...
Lasers as production tools offer several advantages, which are especially relevant for the productio...
AbstractIn the production process of microelectronic devices and high efficiency solar cells, local ...
Ultra short pulse laser ablation is used to open the SiN passivation layer locally. The influence of...
AbstractIn this work SiNX deposited on silicon was locally ablated using laser irradiation. The focu...
A wide range laser pulse duration experiment is carried out including pulse durations from 250 femto...
In the production process of silicon microelectronic devices and high efficiency silicon solar cells...
Present PhD thesis is the experimental and theoretical analysis of thin layer ultrashort pulsed lase...
In order to cut and decollate silicon for the manufacturing of solar cells and electronic components...
AbstractSelective laser ablation of silicon nitride (SiNx) layers is a crucial technological step to...
Laser microstructuring of thin dielectric layers on sensitive electronic devices, such as crystallin...
To increase the conversion efficiency of silicon solar cells the creation of selective emitters is s...
The removal of a 75- to 90-nm-thick passivating silicon nitride antireflection coating from standard...