Strain techniques, such as incorporating SiGe, should boost performance in future generations of CMOS silicon transistors without the need to radically scale transistor dimensions. Although strain is already used for some technology nodes, more knowledge needs to be developed, e.g. on the relationship between strain, carrier mobility and device performance, to employ it further. Also, combination with other options, such as MuGFETs, high-k materials and metal gates, is being considered
The semiconductor industry’s relentless effort to extract enhanced performance from MOS transistors ...
The short-channel performance of compressively strained Si0.77Ge0.23 pMOSFETs with HfSiOx/TiSiN gate...
We introduce a strained-SiGe technology adopting different thicknesses of Si cap layers towards low ...
Strain techniques, such as incorporating SiGe, should boost performance in future generations of CMO...
For recent manufacturable CMOS technologies to extend the Moore’s law, the interest in the strain en...
To keep track with Moore’s law, strain engineering based on either a global or a local approach is g...
peer reviewedAs scaling of the critical transistor dimensions below 65 nm has been slowed down, the ...
peer reviewedAs scaling of the critical transistor dimensions below 65 nm has been slowed down, the ...
[[abstract]]The tensile strained Si, based on the misfit between Si and SiGe gives higher speed and ...
CMOS scaling is rapidly reaching physical limits, forcing the industry to consider alternative route...
Different methods to introduce strain in thin silicon device layers are presented. Uniaxial strain i...
ical gate oxide, 45-nm gate length, strained silicon, NiSi, seven layers of Cu interconnects, and lo...
The conventional planar bulk MOSFET is difficult to scale down to sub-20nm gate length, due to the w...
Silicon based complementary metal-oxide-semiconductor field-effect-transistor (CMOSFET) technology h...
peer reviewedDifferent methods to introduce strain in thin silicon device layers are presented. Unia...
The semiconductor industry’s relentless effort to extract enhanced performance from MOS transistors ...
The short-channel performance of compressively strained Si0.77Ge0.23 pMOSFETs with HfSiOx/TiSiN gate...
We introduce a strained-SiGe technology adopting different thicknesses of Si cap layers towards low ...
Strain techniques, such as incorporating SiGe, should boost performance in future generations of CMO...
For recent manufacturable CMOS technologies to extend the Moore’s law, the interest in the strain en...
To keep track with Moore’s law, strain engineering based on either a global or a local approach is g...
peer reviewedAs scaling of the critical transistor dimensions below 65 nm has been slowed down, the ...
peer reviewedAs scaling of the critical transistor dimensions below 65 nm has been slowed down, the ...
[[abstract]]The tensile strained Si, based on the misfit between Si and SiGe gives higher speed and ...
CMOS scaling is rapidly reaching physical limits, forcing the industry to consider alternative route...
Different methods to introduce strain in thin silicon device layers are presented. Uniaxial strain i...
ical gate oxide, 45-nm gate length, strained silicon, NiSi, seven layers of Cu interconnects, and lo...
The conventional planar bulk MOSFET is difficult to scale down to sub-20nm gate length, due to the w...
Silicon based complementary metal-oxide-semiconductor field-effect-transistor (CMOSFET) technology h...
peer reviewedDifferent methods to introduce strain in thin silicon device layers are presented. Unia...
The semiconductor industry’s relentless effort to extract enhanced performance from MOS transistors ...
The short-channel performance of compressively strained Si0.77Ge0.23 pMOSFETs with HfSiOx/TiSiN gate...
We introduce a strained-SiGe technology adopting different thicknesses of Si cap layers towards low ...