AbstractEnergy dissipation of interconnects is becoming a bottle neck for high performance integrated circuits. This energy dissipation is due to increase in inter-wire capacitance. As CMOS VLSI integration continues with shrinking feature size, the energy dissipation on the on-chip data buses and long capacitance also increases. This capacitance on on-chip data buses and long interconnects plays an important role in the reliability and performance of the system. These onchip data buses consumes major portion of wiring energy. To increase the reliability and performance of the system it is necessary to reduce the energy dissipation on the data bus. Hence transition energy reduction data bus encoding scheme is proposed which can reduce the e...
[[abstract]]In this paper, we propose a bus encoding scheme to minimize coupling effects which cause...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
In this paper we propose a coding scheme for general-purpose applications that can reduce power diss...
AbstractEnergy dissipation of interconnects is becoming a bottle neck for high performance integrate...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
The two main sources of power dissipation in CMOS circuits are static current, which results from re...
Interconnects on deep submicron (DSM) buses incur significantly larger power dissipation, delay perf...
Abstract The energy dissipation associated with driving long wires accounts for a significant fracti...
System on–chip design in deep submicron technology interconnects plays an important role in overall ...
Transitions on high capacitance busses in VLSI systems result in considerable power dissipation. Var...
The power dissipated by Deep Sub-Micron Technology bus is directly related to the switching activity...
The performance factors such as propagation delay, power dissipation and crosstalk in RC modelled in...
Abstract —Power consumption and delay are two of the most important constraints in current-day on-ch...
The energy dissipation of on-chip buses is becoming one of the main bottlenecks in current integrate...
With technology scaling, size of both transistor and interconnects are reduced. Power dissipation du...
[[abstract]]In this paper, we propose a bus encoding scheme to minimize coupling effects which cause...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
In this paper we propose a coding scheme for general-purpose applications that can reduce power diss...
AbstractEnergy dissipation of interconnects is becoming a bottle neck for high performance integrate...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
The two main sources of power dissipation in CMOS circuits are static current, which results from re...
Interconnects on deep submicron (DSM) buses incur significantly larger power dissipation, delay perf...
Abstract The energy dissipation associated with driving long wires accounts for a significant fracti...
System on–chip design in deep submicron technology interconnects plays an important role in overall ...
Transitions on high capacitance busses in VLSI systems result in considerable power dissipation. Var...
The power dissipated by Deep Sub-Micron Technology bus is directly related to the switching activity...
The performance factors such as propagation delay, power dissipation and crosstalk in RC modelled in...
Abstract —Power consumption and delay are two of the most important constraints in current-day on-ch...
The energy dissipation of on-chip buses is becoming one of the main bottlenecks in current integrate...
With technology scaling, size of both transistor and interconnects are reduced. Power dissipation du...
[[abstract]]In this paper, we propose a bus encoding scheme to minimize coupling effects which cause...
In very deep sub-micron designs, cross coupling capacitances become the dominant factor of the total...
In this paper we propose a coding scheme for general-purpose applications that can reduce power diss...