With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performa...
Graphene shows great potential for applications in electronics due to its outstanding physical prope...
Urged by the increasing power and packing densities of integrated circuits and electronic devices, e...
With the recent upsurge in electronic and telecommunications industries, there is an extensive deman...
High density packaging in combination with increased transistor integration inevitably leads to chal...
Abstract Reduced graphene oxide (RGO) and three-dimensional graphene networks (3DGNs) are adopted to...
As transistors continue to decrease in size and packing densities increase, thermal management becom...
High density packaging in combination with increased transistor integration inevitably leads to chal...
Graphene-based papers have recently triggered considerable interests in developing the application a...
We developed high-performance thermal interface materials (TIMs) based on a few-layer graphene (FLG)...
The rapid increase of the packaging integration and power density of devices in electronics leads to...
As a two-dimensional(2D) building block of new materials, graphene has received widespread attention...
With the increasing integration of devices in electronics fabrication, there are growing demands for...
In the first part of this thesis, I present the results of my investigation of thermal characteristi...
With the development of electronic technologies, electronic devices become smaller, while their powe...
With the integration and miniaturization of electronic devices, thermal management has become a cruc...
Graphene shows great potential for applications in electronics due to its outstanding physical prope...
Urged by the increasing power and packing densities of integrated circuits and electronic devices, e...
With the recent upsurge in electronic and telecommunications industries, there is an extensive deman...
High density packaging in combination with increased transistor integration inevitably leads to chal...
Abstract Reduced graphene oxide (RGO) and three-dimensional graphene networks (3DGNs) are adopted to...
As transistors continue to decrease in size and packing densities increase, thermal management becom...
High density packaging in combination with increased transistor integration inevitably leads to chal...
Graphene-based papers have recently triggered considerable interests in developing the application a...
We developed high-performance thermal interface materials (TIMs) based on a few-layer graphene (FLG)...
The rapid increase of the packaging integration and power density of devices in electronics leads to...
As a two-dimensional(2D) building block of new materials, graphene has received widespread attention...
With the increasing integration of devices in electronics fabrication, there are growing demands for...
In the first part of this thesis, I present the results of my investigation of thermal characteristi...
With the development of electronic technologies, electronic devices become smaller, while their powe...
With the integration and miniaturization of electronic devices, thermal management has become a cruc...
Graphene shows great potential for applications in electronics due to its outstanding physical prope...
Urged by the increasing power and packing densities of integrated circuits and electronic devices, e...
With the recent upsurge in electronic and telecommunications industries, there is an extensive deman...