Add to ORKGIn the paper we describe P-medians searching algorithm for Three-dimensional (3D) Network-on-Chip (NoC) design. Modern 3D NoC development is complex and complicated task. Developer should solve different problems: IP bloeks placement on the die, organization or vertical links between dies in the 3D s1ack, energy consumption limitation, system performance improvement. We consider approaches for placement vertical links on the die and suggest a new algorithm that is based on the P-median problem
Three-dimensional (3D) silicon integration technologies have provided new opportunities for Network-...
textThe aggressive scaling of the semiconductor technology following the Moore’s Law has delivered t...
Three dimensional Multiprocessor System-on-Chip (3D-MPSoC) are characterized by the integration of a...
In the paper we describe F-medians searching algorithm for Three-dimensional (3D) Network-on-Chip (N...
none5Three dimensional integration is a promising approach for reducing the form factor of chips. Sc...
With the use of multi-core architectures, the Network-on-Chip (NoC) became an important research top...
Three dimensional Networks-on-Chip (3D NoCs) have attracted a growing interest to solve on-chip comm...
Abstract: Nowadays, three-dimensional network-on-chip (3D NoC) with its shorter global interconnects...
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlight...
AbstractScalable 3D Networks-on-Chip (NoC) designs are needed to match the ever-increasing communica...
Three-dimensional integrated circuits, where multiple silicon layers are stacked vertically have eme...
Three-dimensional (3D) manufacturing technologies are viewed as promising solutions to the bandwidt...
Three-dimensional integrated circuits are a promising approach to push beyond the integration issues...
Three-dimensional integrated circuits are a promising approach to address the integration challenges...
(3D-MPSoC) adoption. It is characterized by the integration of a large amount of hardware components...
Three-dimensional (3D) silicon integration technologies have provided new opportunities for Network-...
textThe aggressive scaling of the semiconductor technology following the Moore’s Law has delivered t...
Three dimensional Multiprocessor System-on-Chip (3D-MPSoC) are characterized by the integration of a...
In the paper we describe F-medians searching algorithm for Three-dimensional (3D) Network-on-Chip (N...
none5Three dimensional integration is a promising approach for reducing the form factor of chips. Sc...
With the use of multi-core architectures, the Network-on-Chip (NoC) became an important research top...
Three dimensional Networks-on-Chip (3D NoCs) have attracted a growing interest to solve on-chip comm...
Abstract: Nowadays, three-dimensional network-on-chip (3D NoC) with its shorter global interconnects...
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlight...
AbstractScalable 3D Networks-on-Chip (NoC) designs are needed to match the ever-increasing communica...
Three-dimensional integrated circuits, where multiple silicon layers are stacked vertically have eme...
Three-dimensional (3D) manufacturing technologies are viewed as promising solutions to the bandwidt...
Three-dimensional integrated circuits are a promising approach to push beyond the integration issues...
Three-dimensional integrated circuits are a promising approach to address the integration challenges...
(3D-MPSoC) adoption. It is characterized by the integration of a large amount of hardware components...
Three-dimensional (3D) silicon integration technologies have provided new opportunities for Network-...
textThe aggressive scaling of the semiconductor technology following the Moore’s Law has delivered t...
Three dimensional Multiprocessor System-on-Chip (3D-MPSoC) are characterized by the integration of a...