Epoxy/cyanate resin matrix composites (AG80/CE) with improved thermal conductivity and mechanical properties were obtained with synergetic enhancement with functional carbon nanotubes (f-CNTs) and hexagonal boron nitride (h-BN). AG80/CE performed as polymeric matrix and h-BN as conductivity filler which formed the main thermal conductivity channels. Small amounts of f-CNTs were introduced to repair defects in conductivity channels and networks. To confirm the synergetic enhancements, the thermal conductivity was investigated and analyzed with Agari’s model. Results indicated that with introduction of 0.5 wt% f-CNTs, the thermal conductivity coefficient (ƛ) increased to 0.745 W/mk, which is 1.38 times that of composites with just h-BN....
This work placed an emphasis that constructing segregated boron nitride (BN)/carbon nanotube (CNT) h...
This article finds that the synergy of natural fiber with hexagonal boron nitride (hBN) could signif...
Owing to the increasing heat dissipation problem of advanced modern electronic devices, polymer comp...
Developing polymer-based nanocomposites with high thermal conductivity, mechanical performance, and ...
Carbon fillers including multi-walled carbon nanotubes (MWCNTs), carbon black (CB) and graphite were...
Epoxy as a type of matrix material has been extensively applied for printed circuit boards (PCBs) an...
In this study, we constructed hybrid three-dimensional (3D) filler networks by simply incorporating ...
The development of thermal conduction polymer-based composites is important to solve the heat dissip...
This study suggests the simple and effective synthesis method of chemically interconnected hexagonal...
Boron nitride(BN) nanometer material was adding as filler to epoxy resin to obtain a high thermal co...
Epoxy resin is a common adhesive bonding material used to join dissimilar materials, especially in t...
In order to improve the thermal conductivity of 30 wt % synthetic graphite (SG)-filled polyketones (...
Thermal dissipation is a critical aspect for the performance and lifetime of electronic devices. In ...
The orientation of ultrahigh aspect ratio thermally conductive fillers can construct a heat transfer...
This work is focused on developing an epoxy-based hybrid composite using BN and VGCNF, with the main...
This work placed an emphasis that constructing segregated boron nitride (BN)/carbon nanotube (CNT) h...
This article finds that the synergy of natural fiber with hexagonal boron nitride (hBN) could signif...
Owing to the increasing heat dissipation problem of advanced modern electronic devices, polymer comp...
Developing polymer-based nanocomposites with high thermal conductivity, mechanical performance, and ...
Carbon fillers including multi-walled carbon nanotubes (MWCNTs), carbon black (CB) and graphite were...
Epoxy as a type of matrix material has been extensively applied for printed circuit boards (PCBs) an...
In this study, we constructed hybrid three-dimensional (3D) filler networks by simply incorporating ...
The development of thermal conduction polymer-based composites is important to solve the heat dissip...
This study suggests the simple and effective synthesis method of chemically interconnected hexagonal...
Boron nitride(BN) nanometer material was adding as filler to epoxy resin to obtain a high thermal co...
Epoxy resin is a common adhesive bonding material used to join dissimilar materials, especially in t...
In order to improve the thermal conductivity of 30 wt % synthetic graphite (SG)-filled polyketones (...
Thermal dissipation is a critical aspect for the performance and lifetime of electronic devices. In ...
The orientation of ultrahigh aspect ratio thermally conductive fillers can construct a heat transfer...
This work is focused on developing an epoxy-based hybrid composite using BN and VGCNF, with the main...
This work placed an emphasis that constructing segregated boron nitride (BN)/carbon nanotube (CNT) h...
This article finds that the synergy of natural fiber with hexagonal boron nitride (hBN) could signif...
Owing to the increasing heat dissipation problem of advanced modern electronic devices, polymer comp...