Experimental studies of the Cu-Sb-Sn and Ni-Sb-Sn systems have been carried out by the wetting tests, followed by the analysis of the microstructural evolution occurring at the interface between the liquid alloy and solid substrate. The wetting experiments on the Sb30Sn70 / (Cu, Ni) and Sb38.4Sn61.6 / (Cu, Ni) systems have been performed by using a sessile drop apparatus. The wetting behaviour of the two alloys in contact with Cu-substrate differs from that observed in the case of Ni-substrate. The Sb-Sn alloy / substrate interface was characterised by SEM-EDS analyses. For each system, the solidliquid interactions and the phases formed at the interface were studied with the help of the corresponding phase diagrams
[[abstract]]c2003 Springer - Specimens with the Sn/Cu/Sn/Ni/Sn/Cu/Sn structure reacted at 200°C are ...
Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0...
[[abstract]]©2003 MRS - Wetting properties of lead-free solders, Sn-0.7 wt.% Cu and Sn-3.5 wt.% Ag, ...
Experimental studies of the Cu-Sb-Sn and Ni-Sb-Sn systems have been carried out by the wetting tests...
Interfacial reactions in the SbeSn/Cu and SbeSn/Ni systems have been investigated by means of wettin...
[[abstract]]c2003 Springer - Wetting and interfacial reactions occurred when molten Sn-Bi alloys wer...
International audienceThe wetting of Cu-Fe two-phase composites by molten Sn is studied by the sessi...
Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as ...
Wettability and interfacial characteristic of the Sn-3.0Ag-0.5Cu/Ni system are investigated by sessi...
Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as ...
The sessile drop method was used in the present experiment to study the spreading wetting principle....
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu have been investigated at temperatu...
The manuscript presents studies of the interaction of Sn–Zn eutectic solder alloy with a solid coppe...
Wetting behavior and interfacial characteristic of the Sn-3.5Ag/Ni system are investigated by sessil...
The manuscript presents studies of the interaction of Sn–Zn eutectic solder alloy with a solid coppe...
[[abstract]]c2003 Springer - Specimens with the Sn/Cu/Sn/Ni/Sn/Cu/Sn structure reacted at 200°C are ...
Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0...
[[abstract]]©2003 MRS - Wetting properties of lead-free solders, Sn-0.7 wt.% Cu and Sn-3.5 wt.% Ag, ...
Experimental studies of the Cu-Sb-Sn and Ni-Sb-Sn systems have been carried out by the wetting tests...
Interfacial reactions in the SbeSn/Cu and SbeSn/Ni systems have been investigated by means of wettin...
[[abstract]]c2003 Springer - Wetting and interfacial reactions occurred when molten Sn-Bi alloys wer...
International audienceThe wetting of Cu-Fe two-phase composites by molten Sn is studied by the sessi...
Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as ...
Wettability and interfacial characteristic of the Sn-3.0Ag-0.5Cu/Ni system are investigated by sessi...
Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as ...
The sessile drop method was used in the present experiment to study the spreading wetting principle....
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu have been investigated at temperatu...
The manuscript presents studies of the interaction of Sn–Zn eutectic solder alloy with a solid coppe...
Wetting behavior and interfacial characteristic of the Sn-3.5Ag/Ni system are investigated by sessil...
The manuscript presents studies of the interaction of Sn–Zn eutectic solder alloy with a solid coppe...
[[abstract]]c2003 Springer - Specimens with the Sn/Cu/Sn/Ni/Sn/Cu/Sn structure reacted at 200°C are ...
Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0...
[[abstract]]©2003 MRS - Wetting properties of lead-free solders, Sn-0.7 wt.% Cu and Sn-3.5 wt.% Ag, ...