A geometrically simplified plane elasticity problem of a finite small crack emanating from a thin interfacial zone surrounding the circular inclusion situated in the finite bounded domain is investigated. The crack is arbitrarily oriented and modelled using the distribution dislocation technique. This model represents the inner solution of the studied problem. The corresponding fundamental solution is based on the application of Muskhelishvili complex potentials in the form of the Laurent series. The coefficients of the series are evaluated from the compatibility conditions along the interfaces of the inclusion, the interfacial zone and the enclosing matrix. The fundamental solution is also used in the solution of the boundary integral meth...
International audienceWe consider the problem of two cracks of different lengths, subjected to a uni...
The interaction between an inhomogeneity and a crack propagating near the circular inhomogeneity is ...
Microdefects such as cracks, vacancies, voids and inclusions are often formed in materials during th...
A geometrically simplified plane elasticity problem of a finite small crack emanating from a thin in...
The problem of the crack emanating from the interphase region of the circular inclusion is investiga...
The interaction of an interfacial crack with small impurities is analysed on the basis of an asympto...
The plane interaction problem for a circular elastic inclusion imbedded into an elastic matrix which...
The plane strain problem of a single circular cylindrical inclusion embedded in an unbounded matrix...
We consider the quasi-static propagation of a Mode III crack along the interface in a bimaterial pla...
AbstractThe plane strain problem of a single circular cylindrical inclusion embedded in an unbounded...
A model of a circular disk fracture based on consideration of the fracture process zone near the cur...
International audienceCrack propagation associated with two initially symmetrical cracks located at ...
AbstractA complete solution has been obtained of the elasticity problem for a plane containing a fin...
The paper addresses the problem of a Mode III interfacial crack advancing quasi-statically in a hete...
Abstract: The solution for the elastic three-phase circular inclusion problem plays a fundamental ro...
International audienceWe consider the problem of two cracks of different lengths, subjected to a uni...
The interaction between an inhomogeneity and a crack propagating near the circular inhomogeneity is ...
Microdefects such as cracks, vacancies, voids and inclusions are often formed in materials during th...
A geometrically simplified plane elasticity problem of a finite small crack emanating from a thin in...
The problem of the crack emanating from the interphase region of the circular inclusion is investiga...
The interaction of an interfacial crack with small impurities is analysed on the basis of an asympto...
The plane interaction problem for a circular elastic inclusion imbedded into an elastic matrix which...
The plane strain problem of a single circular cylindrical inclusion embedded in an unbounded matrix...
We consider the quasi-static propagation of a Mode III crack along the interface in a bimaterial pla...
AbstractThe plane strain problem of a single circular cylindrical inclusion embedded in an unbounded...
A model of a circular disk fracture based on consideration of the fracture process zone near the cur...
International audienceCrack propagation associated with two initially symmetrical cracks located at ...
AbstractA complete solution has been obtained of the elasticity problem for a plane containing a fin...
The paper addresses the problem of a Mode III interfacial crack advancing quasi-statically in a hete...
Abstract: The solution for the elastic three-phase circular inclusion problem plays a fundamental ro...
International audienceWe consider the problem of two cracks of different lengths, subjected to a uni...
The interaction between an inhomogeneity and a crack propagating near the circular inhomogeneity is ...
Microdefects such as cracks, vacancies, voids and inclusions are often formed in materials during th...