A full three-dimensional technology-computer-aided-design-based reliability prediction model was proposed for dynamic random-access memory (DRAM) storage capacitors. The model can be used to predict the time-dependent dielectric breakdown as well as leakage current of a state-of-the-art DRAM storage capacitor with a complex three-dimensional structure
Time dependent dielectric breakdown (TDDB) and stress-induced leakage current (SILC) are investigate...
In DRAMs, stored data on a capacitor tend to leak over time because of leakage current. To retain da...
In electronic vehicles (EVs) or hybrid electronic vehicles (HEVs), an inverter system has a direct-c...
A full three-dimensional technology-computer-aided-design-based reliability prediction model was pro...
The influence of etch profiles on leakage current and capacitance of three-dimensional (3-D) dynamic...
An increasing amount of critical applications use DRAM as main memory in its computing systems. It i...
In this paper, we present a physically-based Monte-Carlo (MC) model reproducing the leakage current ...
In this paper, we present a physically-based Monte-Carlo (MC) model reproducing the leakage current ...
Some analysts fear that the semiconductor technology has entered, or is about to enter, the mature s...
We present a quantitative physical model describingthe current evolution due to the formation of a c...
Predict possible types of physical defects from electrical failure analysis using the Micromate test...
Time dependent dielectric breakdown (TDDB) is one of the important failure mechanisms for Copper (Cu...
Sophisticated computer tools and techniques have been developed to increase the productivity of the ...
With the scaling of the CMOS technology and the associated gate oxide thickness, the reliability of ...
This thesis considers methods for predicting reliability and mean time to first failure of complex s...
Time dependent dielectric breakdown (TDDB) and stress-induced leakage current (SILC) are investigate...
In DRAMs, stored data on a capacitor tend to leak over time because of leakage current. To retain da...
In electronic vehicles (EVs) or hybrid electronic vehicles (HEVs), an inverter system has a direct-c...
A full three-dimensional technology-computer-aided-design-based reliability prediction model was pro...
The influence of etch profiles on leakage current and capacitance of three-dimensional (3-D) dynamic...
An increasing amount of critical applications use DRAM as main memory in its computing systems. It i...
In this paper, we present a physically-based Monte-Carlo (MC) model reproducing the leakage current ...
In this paper, we present a physically-based Monte-Carlo (MC) model reproducing the leakage current ...
Some analysts fear that the semiconductor technology has entered, or is about to enter, the mature s...
We present a quantitative physical model describingthe current evolution due to the formation of a c...
Predict possible types of physical defects from electrical failure analysis using the Micromate test...
Time dependent dielectric breakdown (TDDB) is one of the important failure mechanisms for Copper (Cu...
Sophisticated computer tools and techniques have been developed to increase the productivity of the ...
With the scaling of the CMOS technology and the associated gate oxide thickness, the reliability of ...
This thesis considers methods for predicting reliability and mean time to first failure of complex s...
Time dependent dielectric breakdown (TDDB) and stress-induced leakage current (SILC) are investigate...
In DRAMs, stored data on a capacitor tend to leak over time because of leakage current. To retain da...
In electronic vehicles (EVs) or hybrid electronic vehicles (HEVs), an inverter system has a direct-c...