Thin films with large compressive residual stress and low interface adhesion can buckle and delaminate from relatively rigid substrates, which is a common failure mode of film/substrate interfaces. Current studies mainly focused on the geometry of various buckling patterns and related physical origins based on a static point of view. However, fundamental understanding of dynamic propagation of buckles, particularly for the complicated web buckles, remains challenging. We adopt strained two-dimensional MoS2 thin films to study the phenomenon of web buckling because their interface adhesion, namely van der Waals interaction, is naturally low. With a delicately site-controlled initiation, web buckles can be triggered and their dynamic propagat...
The mechanical and optical properties generated due to the stacking of different atomically thin mat...
While there are many stress relief mechanisms observed in thin films, excessive residual and externa...
Deformable electronics have diverse applications, such as curved imaging surfaces, sensor skins, and...
Thin films with large compressive residual stress and low interface adhesion can buckle and delamina...
Thin films with large compressive residual stress and low interface adhesion can buckle and delamina...
Deformation and fracture of thin films on compliant substrates are key factors c...
Delamination of thin films from the supportive substrates is a critical issue within the thin film i...
International audienceThin films with low adhesion and large residual stresses may buckle. The resul...
abstract: The data and results presented in this paper are part of a continuing effort to innovate a...
Buckling of thin films on a rigid substrate during use or fabrication is a well-known but unwanted p...
Buckling of thin films on a rigid substrate during use or fabrication is a well-known but unwanted p...
Buckling of thin films on a rigid substrate during use or fabrication is a well-known but unwanted p...
Self-assembled buckling patterns of thin films on compliant substrates have been subjected to extens...
AbstractElectronic systems with large stretchability have many applications. A precisely controlled ...
There are many different stress relief mechanisms observed in thin films. One of the mechanisms invo...
The mechanical and optical properties generated due to the stacking of different atomically thin mat...
While there are many stress relief mechanisms observed in thin films, excessive residual and externa...
Deformable electronics have diverse applications, such as curved imaging surfaces, sensor skins, and...
Thin films with large compressive residual stress and low interface adhesion can buckle and delamina...
Thin films with large compressive residual stress and low interface adhesion can buckle and delamina...
Deformation and fracture of thin films on compliant substrates are key factors c...
Delamination of thin films from the supportive substrates is a critical issue within the thin film i...
International audienceThin films with low adhesion and large residual stresses may buckle. The resul...
abstract: The data and results presented in this paper are part of a continuing effort to innovate a...
Buckling of thin films on a rigid substrate during use or fabrication is a well-known but unwanted p...
Buckling of thin films on a rigid substrate during use or fabrication is a well-known but unwanted p...
Buckling of thin films on a rigid substrate during use or fabrication is a well-known but unwanted p...
Self-assembled buckling patterns of thin films on compliant substrates have been subjected to extens...
AbstractElectronic systems with large stretchability have many applications. A precisely controlled ...
There are many different stress relief mechanisms observed in thin films. One of the mechanisms invo...
The mechanical and optical properties generated due to the stacking of different atomically thin mat...
While there are many stress relief mechanisms observed in thin films, excessive residual and externa...
Deformable electronics have diverse applications, such as curved imaging surfaces, sensor skins, and...