Spectroscopic photon emission microscopy (SPEM) is a non-destructive technique used as a defect localizing tool and as an indicator of the failure mechanisms. This thesis presents a new system of SPEM developed to study the reliability of wide band Gap power devices notably SiC MOSFETs and AlGaN/GaN HEMTs. An overview of different fundamental aspects of the light emission defects on semiconductors devices is presented. The electroluminescence spectral analysis of high power stressed SiC MOSFETs and AlGaN/GaN HEMTs is reported and correlated with electrical and micro-structural analysis to localize the failures and identify the physical origin of the performance drift of these components.La microscopie à émission de photons spectrale (SPEM) ...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
Spectroscopic photon emission microscopy (SPEM) is a non-destructive technique used as a defect loca...
Spectroscopic photon emission microscopy (SPEM) is a non-destructive technique used as a defect loca...
Spectroscopic photon emission microscopy (SPEM) is a non-destructive technique used as a defect loca...
In this paper, we present one of the most important failure analysis tools that permits the localizi...
International audienceIn this paper, we present one of the most important failure analysis tools tha...
In this paper, we present one of the most important failure analysis tools that permits the localizi...
International audienceIn this paper, we present one of the most important failure analysis tools tha...
The present thesis is a study of the evolution of defect states in devices based on wide bandgap sem...
Photon emission microscopy (PEM) is a technique used commonly for failure analysis of microelectroni...
Photon emission microscopy (PEM) is a technique used commonly for failure analysis of microelectroni...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
Spectroscopic photon emission microscopy (SPEM) is a non-destructive technique used as a defect loca...
Spectroscopic photon emission microscopy (SPEM) is a non-destructive technique used as a defect loca...
Spectroscopic photon emission microscopy (SPEM) is a non-destructive technique used as a defect loca...
In this paper, we present one of the most important failure analysis tools that permits the localizi...
International audienceIn this paper, we present one of the most important failure analysis tools tha...
In this paper, we present one of the most important failure analysis tools that permits the localizi...
International audienceIn this paper, we present one of the most important failure analysis tools tha...
The present thesis is a study of the evolution of defect states in devices based on wide bandgap sem...
Photon emission microscopy (PEM) is a technique used commonly for failure analysis of microelectroni...
Photon emission microscopy (PEM) is a technique used commonly for failure analysis of microelectroni...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...
International audienceThis paper aims to study the SiC power MOSFETs robustness to Electrostatic Dis...