Bonding Characterization of a Three-Layer Metal-Adhesive-Metal Using Shear Horizontal Modes of Close Dispersion Curves

International audienceThis work presents numerical and experimental results on the evaluation of the quality of bonding in a metaladhesive-metal three-layer structure using shear horizontal (SH) guided waves. The studied samples have differentlevels of adhesion. A numerical finite element simulation based on the Jones model permits to predict thedispersion curves in the different cases. An experimental study, based on a generation of waves by an EMATtransducer and a reception by a piezocomposite transducer, is performed. Results show that a criterion on thequality of the bonding can be found when the quality of the adhesive is degraded by addition of grease in theadhesive, based on the simultaneous propagation, or not, of two close wavenumber-frequency modes of the threelayer