Miniaturization of Intermediate Frequency Module and Multiplier Module for AMiBA Receiver

本論文主要敘述AMIBA無線電天文望遠鏡接收機之中頻與倍頻模組，以MIC組裝方式及薄膜製程將其尺寸微小化之設計、研製與測試結果。其中的中頻模組包含三級中頻放大器及一個頻率等化器，倍頻模組則包含倍頻器、42GHz前級放大器、功率分配器、射頻開關、移相器以及42GHz後級輸出放大器等。相較於原來的模組，設計之中頻及倍頻模組尺寸，確實能夠達到微小化之目標。論文之第二章及第三章主要敘述倍頻及中頻模組之設計及組裝。論文的第四章則主要敘述倍頻及中頻模組之量測結果。由於AMiBA接收機是架設於戶外，受到環境溫度變化的影響較大，因此除了常溫以外，也進行於高低溫的量測。第五章的結論主要是針對問題提出改善措施。This thesis focuses on the design and fabrication using MIC approach and thin film process to miniaturize the dimensions of intermediate frequency module and multiplier module, for application in the AMiBA receiver. Results of the integration and test are also described. The intermediate frequency module consists of four stages including three intermediate frequency amplifiers and one frequency equalizer. The multiplier module consists of five stages. They are multiplier, 42GHz pre-amplifier, power divider, phase shifter and 42GHz post-amplifier. Comparing to the previous design, this new module design with thin film process and MIC approach can indeed achieve the goal of module miniaturization. Chapters 2 and 3 mainly explain the design and assembly of the multiplier module and intermediate frequency module. In Chapter 4, test results of multiplier module and intermediate frequency module are presented. Since the AMiBA receiver is operated in outdoor environment and its performance is affected by the environmental temperature. the tests described in this thesis are performed under room temperature, high temperature and low temperature. Finally, Chapter 5 summarizes and describes the design issues and the future improvement.摘要...................................................................................................................I 第一章 緒論.....................................................................................................1 1.1 AMiBA接收機簡介............................................................................1 1.2 AMiBA接收機系統............................................................................2 1.2.1 倍頻模組...............................................................................4 1.2.2 中頻模組...............................................................................5 1.3 模組微小化之優點.............................................................................6 第二章 倍頻模組.............................................................................................8 2.1 倍頻模組與鏈路計算.........................................................................8 2.2 單級電路特性預估與模擬.................................................................8 2.2.1 42GHz倍頻器........................................................................9 2.2.2 42GHz信號之前級放大器..................................................14 2.2.3 功率分配器..........................................................................15 2.2.4 90度移相器及切換電路......................................................19 2.2.5 42GHz之後級放大器...........................................................22 2.2.6 偏壓與控制電路..................................................................25 2.3 整合模組之特性預估........................................................................28 2.3.1 信號於開關切換之間的90度相移......................................29 2.3.2 模組整合之穩定度..............................................................29 2.3.3 模組於高低溫下之特性變化................................................31 2.4 模組組裝............................................................................................32 2.4.1 測試治具..............................................................................32 2.4.2 組裝及電氣特性測試程序..................................................35 第三章 中頻模組............................................................................................38 3.1 中頻模組與鏈路計算........................................................................38 3.2 單級電路特性預估與模擬................................................................39 3.2.1 中頻放大器..........................................................................39 3.2.2 等化器..................................................................................42 3.3 整合模組之特性預估........................................................................42 3.3.1 模組整合之穩定度..............................................................43 3.3.2 模組整合後之頻率響應......................................................46 3.3.3 模組於高低溫下之特性變化..............................................46 3.4模組組裝..............................................................................................47 3.4.1 組裝及電氣特性測試程序..................................................47 第四章 模組測試結果分析...........................................................................49 4.1 倍頻模組之單級電路測試結果分析...............................................49 4.1.1 倍頻器.................................................................................49 4.1.2 42GHz前級放大器.............................................................51 4.1.3 功率分配器.........................................................................54 4.1.4 90度移相與開關電路.........................................................55 4.1.5 42GHz第二級放大器.........................................................61 4.2 中頻模組之單級電路特性驗證......................................................66 4.2.1 中頻放大器.........................................................................66 4.2.2 等化器.................................................................................71 4.3 整合模組之測試結果分析...............................................................73 4.3.1 倍頻模組整合.....................................................................73 4.3.2 中頻模組整合....................................................................78 第五章 結論..................................................................................................83 參考文獻........................................................................................................85 附錄................................................................................................................86 A1 應用於倍頻及中頻模組之主動式偏壓電路.........................................86 A2 元件資料表…………………………………………………………….89 A3 測試治具機構圖………………………………………………………11