無鉛銲錫球格陣列構裝製程與可靠度分析─總計畫(III)

總計劃的主要目的係經由群體研究無鉛焊錫球格陣列構裝製程、界面反應動力學研究與破損分析，建立無鉛銲錫接點壽命的預測模型，完成BGA構裝在化金(Ni/Au)電路板上的可靠度資料庫，做為相關研究學者或產業界的重要應用依據。此外，利用構裝模組的電性分析可提供更直接的應用參考數據，配合金相分析探討銲錫接點的界金屬成長、組織變化及疲勞裂紋的萌生與成長。最後，由於整體構裝模組構成材料複雜，微觀組織影響疲勞壽命 甚大，致使數據離散性較大，故本研究亦藉由機率、統計等相關理論，對整個系統進行可靠度分析，了解壽命分佈情況，預估疲勞壽命。Through the group studies including the manufacturing process, interfacial reaction kinetics and failure analysis, the prediction model of failure life for Pb-free solder joints of BGA packages with Au/Ni surface finish. In addition, using the electrical analysis for packaging modulus more direct information can be obtained. Accompanying with the metallographic observations, the intermetallics growth, microstructure change, crack nucleation and propagation of solder joints are investigated. Finally, the probability and statistics theory are employed to evaluate the reliability of the whole packaging system, which result in the clarification of failure life distribution and the prediction of failure life