The programming performance, cycling endurance and scaling of CHISEL NOR flash EEPROMs is studied for two different (halo and no-halo) channel engineering schemes. Programming speed under identical bias, bias requirements under similar programming time, cycling endurance and drain disturb are compared. The scaling properties of programming time (at a fixed bias), bias (at a fixed programming time) and program/disturb margin are studied as cell floating gate length is scaled. The relative merits of these channel engineering schemes are discussed from the viewpoint of futuristic CHISEL cell design.© IEE
In this work, we demonstrate the feasibility of using channel initiated secondary electron (CHISEL) ...
The origin of drain disturb in NOR Flash EEPROM cells under Channel Initiated Secondary Electron (CH...
Multi-level (ML) storage is becoming an important option to achieve high-density flash EEPROMs. This...
The programming performance, cycling endurance and scaling of CHISEL NOR flash EEPROMs is studied fo...
The programming performance, cycling endurance and scaling of CHISEL NOR flash EEPROMs is studied fo...
The impact of technological parameter (channel doping, source/drain junction depth) variation and ch...
The impact of technological parameter (channel doping, source/drain junction depth) variation and ch...
The impact of programming biases, device scaling and variation of technological parameters on channe...
The impact of programming biases, device scaling and variation of technological parameters on channe...
The impact of programming biases, device scaling and variation of technological parameters on channe...
In this work, we demonstrate the feasibility of using channel initiated secondary electron (CHISEL) ...
In this work, we demonstrate the feasibility of using Channel Initiated Secondary Electron (CHISEL) ...
The effect of programming biases on the cycling endurance of NOR flash EEPROMs is studied under CHE ...
The effect of programming biases on the cycling endurance of NOR flash EEPROMs is studied under CHE ...
The effect of programming biases on the cycling endurance of NOR flash EEPROMs is studied under CHE ...
In this work, we demonstrate the feasibility of using channel initiated secondary electron (CHISEL) ...
The origin of drain disturb in NOR Flash EEPROM cells under Channel Initiated Secondary Electron (CH...
Multi-level (ML) storage is becoming an important option to achieve high-density flash EEPROMs. This...
The programming performance, cycling endurance and scaling of CHISEL NOR flash EEPROMs is studied fo...
The programming performance, cycling endurance and scaling of CHISEL NOR flash EEPROMs is studied fo...
The impact of technological parameter (channel doping, source/drain junction depth) variation and ch...
The impact of technological parameter (channel doping, source/drain junction depth) variation and ch...
The impact of programming biases, device scaling and variation of technological parameters on channe...
The impact of programming biases, device scaling and variation of technological parameters on channe...
The impact of programming biases, device scaling and variation of technological parameters on channe...
In this work, we demonstrate the feasibility of using channel initiated secondary electron (CHISEL) ...
In this work, we demonstrate the feasibility of using Channel Initiated Secondary Electron (CHISEL) ...
The effect of programming biases on the cycling endurance of NOR flash EEPROMs is studied under CHE ...
The effect of programming biases on the cycling endurance of NOR flash EEPROMs is studied under CHE ...
The effect of programming biases on the cycling endurance of NOR flash EEPROMs is studied under CHE ...
In this work, we demonstrate the feasibility of using channel initiated secondary electron (CHISEL) ...
The origin of drain disturb in NOR Flash EEPROM cells under Channel Initiated Secondary Electron (CH...
Multi-level (ML) storage is becoming an important option to achieve high-density flash EEPROMs. This...