The impact of program/erase (P/E) cycling on drain disturb in NOR Flash EEPROM cells under channel hot electron (CHE) and channel-initiated secondary electron (CHISEL) programming operation is studied. Charge gain disturb increases and charge loss disturb decreases after cycling under CHE and CHISEL operation. Carefully designed experiments and fullband Monte Carlo simulations were used to explain this behavior. P/E cycling induced degradation in gate coupling coefficient and the resulting increase in source/drain leakage, reduction in band-to-band tunneling and change in carrier injection area seems to explain well the behavior of CHE and CHISEL drain disturb after cycling.IEE
In this paper, a complete study of the cell reliability based on a unique oxide damage characterizat...
The mechanism of drain disturb is studied in silicon-oxide-nitride-oxide-silicon Flash electrically ...
A novel concept of Soft Secondary Electron Programming (SSEP) is introduced and shown to be a promis...
The impact of Program/Erase (P/E) cycling on drain disturb in NOR Flash EEPROM cells under Channel H...
Drain disturb is studied in NOR flash EEPROM cells under CHE and CHISEL programming operation, befor...
In this paper, we report an extensive study of drain disturb in isolated cells under channel hot ele...
The origin of drain disturb in NOR Flash EEPROM cells under Channel Initiated Secondary Electron (CH...
The effect of programming biases on the cycling endurance of NOR flash EEPROMs is studied under CHE ...
A new technique for separating the oxide damage due to program/erase (P/E) cycling and of parasitic ...
The impact of technological parameter (channel doping, source/drain junction depth) variation and ch...
The impact of programming biases, device scaling and variation of technological parameters on channe...
The impact of programming biases, device scaling and variation of technological parameters on channe...
The impact of programming biases, device scaling and variation of technological parameters on channe...
The impact of technological parameter (channel doping, source/drain junction depth) variation and ch...
In this work, we demonstrate the feasibility of using channel initiated secondary electron (CHISEL) ...
In this paper, a complete study of the cell reliability based on a unique oxide damage characterizat...
The mechanism of drain disturb is studied in silicon-oxide-nitride-oxide-silicon Flash electrically ...
A novel concept of Soft Secondary Electron Programming (SSEP) is introduced and shown to be a promis...
The impact of Program/Erase (P/E) cycling on drain disturb in NOR Flash EEPROM cells under Channel H...
Drain disturb is studied in NOR flash EEPROM cells under CHE and CHISEL programming operation, befor...
In this paper, we report an extensive study of drain disturb in isolated cells under channel hot ele...
The origin of drain disturb in NOR Flash EEPROM cells under Channel Initiated Secondary Electron (CH...
The effect of programming biases on the cycling endurance of NOR flash EEPROMs is studied under CHE ...
A new technique for separating the oxide damage due to program/erase (P/E) cycling and of parasitic ...
The impact of technological parameter (channel doping, source/drain junction depth) variation and ch...
The impact of programming biases, device scaling and variation of technological parameters on channe...
The impact of programming biases, device scaling and variation of technological parameters on channe...
The impact of programming biases, device scaling and variation of technological parameters on channe...
The impact of technological parameter (channel doping, source/drain junction depth) variation and ch...
In this work, we demonstrate the feasibility of using channel initiated secondary electron (CHISEL) ...
In this paper, a complete study of the cell reliability based on a unique oxide damage characterizat...
The mechanism of drain disturb is studied in silicon-oxide-nitride-oxide-silicon Flash electrically ...
A novel concept of Soft Secondary Electron Programming (SSEP) is introduced and shown to be a promis...