The objective of this work is to study the effect of room temperature (RT) and liquid nitrogen temperature (LNT) rolling on mechanical properties of the pure copper. For the same percentage deformation, LNT samples show a significant increase in tensile strength and hardness value compared to RT samples. Microstructural investigation shows a large misorientation change between RT and LNT samples when we use grain orientation spread (GOS) as a measure of microstructural change. The mechanical property and microstructural changes are correlated with calorimetry experiments. We also present some preliminary results from our work on wire drawing at RT and LNT
The microstructure formation during annealing of cryogenically deformed copper was studied. It was s...
Accumulative Roll Bonding (ARB), which is a process of severe plastic deformation (SPD), was applie...
Drawn and annealed copper wires of diameters ranging from 50 μ to 900 μ were tested in tension and t...
Due to the character of the original source materials and the nature of batch digitization, quality ...
ABSTRACT The pure copper wires were wiredrawn at cryogenic and room temperatures. After deformation ...
Cu samples were subjected to high-pressure torsion (HPT) with up to 6 turns at room temperature (RT)...
Nowadays, there is a considerable scientific interest in bulk ultrafine grained materials, due to th...
Nowadays, there is a considerable scientific interest in bulk ultrafine grained materials, due to th...
A high-resolution electron backscatter diffraction technique was applied to quantify grain-structure...
A high-resolution electron backscatter diffraction technique was applied to quantify grain-structure...
Nowadays, there is a considerable scientific interest in bulk ultrafine grained materials, due to th...
The effect of cryogenic temperature and change of strain path on grain refinement during the rolling...
The effect of cryogenic temperature and change of strain path on grain refinement during the rolling...
The purpose of this paper is to investigate the effect of dynamic recovery on the mechanical propert...
Drawn and annealed copper wires of diameters ranging from 50 μ to 900 μ were tested in tension and t...
The microstructure formation during annealing of cryogenically deformed copper was studied. It was s...
Accumulative Roll Bonding (ARB), which is a process of severe plastic deformation (SPD), was applie...
Drawn and annealed copper wires of diameters ranging from 50 μ to 900 μ were tested in tension and t...
Due to the character of the original source materials and the nature of batch digitization, quality ...
ABSTRACT The pure copper wires were wiredrawn at cryogenic and room temperatures. After deformation ...
Cu samples were subjected to high-pressure torsion (HPT) with up to 6 turns at room temperature (RT)...
Nowadays, there is a considerable scientific interest in bulk ultrafine grained materials, due to th...
Nowadays, there is a considerable scientific interest in bulk ultrafine grained materials, due to th...
A high-resolution electron backscatter diffraction technique was applied to quantify grain-structure...
A high-resolution electron backscatter diffraction technique was applied to quantify grain-structure...
Nowadays, there is a considerable scientific interest in bulk ultrafine grained materials, due to th...
The effect of cryogenic temperature and change of strain path on grain refinement during the rolling...
The effect of cryogenic temperature and change of strain path on grain refinement during the rolling...
The purpose of this paper is to investigate the effect of dynamic recovery on the mechanical propert...
Drawn and annealed copper wires of diameters ranging from 50 μ to 900 μ were tested in tension and t...
The microstructure formation during annealing of cryogenically deformed copper was studied. It was s...
Accumulative Roll Bonding (ARB), which is a process of severe plastic deformation (SPD), was applie...
Drawn and annealed copper wires of diameters ranging from 50 μ to 900 μ were tested in tension and t...