Metal-Nitride-Semiconductor FETs with channel lengths down to 100 nm & anovel Jet Vapor Deposited (JVD) SiN gate dielectric are fabricated and characterised for thier hot-carrier reliability.A novel charge pumping technique is employed to characterize the stress induced interface degradation of such MNSFETs in comparison to MOSFETs having thermal SiO2 gate oxide.Under identical substrate current during stress,MNSFETs show less interface-state generation and resulting drain current degradation for various channels lengths,stress time and supply voltage.The time and voltage dependence of hot-carrier degradation has been found to be distinctly different for MNSFETs compared to conventional SiO2 MOSFETs.© IEE
The influence of channel length and oxide thickness on the hot-carrier induced interface (Nit) and o...
Due to the increased physical dielectric thickness and reduced gate leakage in metal-gate/high-k dev...
Hot electron induced degradation in 0.25 {micro}m, n-channel MOSFETs annealed in H{sub 2} or D{sub 2...
Metal-Nitride-Semiconductor FETs with channel lengths down to 100 nm & anovel Jet Vapor Deposite...
Metal-nitride-semiconductor FETs (MNSFETs) having channel lengths down to 100 mm and a novel jet vap...
Metal-nitride-semiconductor FETs (MNSFETs) having channel lengths down to 100 mm and a novel jet vap...
Conventional interface characterization techniques, such as charge pumping, cannot be applied to SOI...
Metal-nitride-semiconductor (MNS) FETs with channel lengths down to 100 nm with a novel jet vapor de...
In this paper, we study the reliability of n-channel Metal-Nitride-Silicon FETs fabricated using ult...
In this paper, we study the stress voltage polarity-dependent reliability of n-channel metal-nitride...
session posterInternational audienceThe HC degradation of nanoscale FD-SOI n-MOSFETs has been invest...
Abstract—In this paper, we study the stress voltage polarity-de-pendent reliability of n-channel met...
We have studied high field degradation of Jet Vapor Deposited (JVD) silicon nitride MNSFETs with DC ...
The hot-carrier degradation of deep-submicrometer LDD nMOSFETs under different gate-stress regimes i...
SOI MNSFETs with channel lengths down to 100 nm and having a Jet Vapor Deposited (JVD) silicon nitri...
The influence of channel length and oxide thickness on the hot-carrier induced interface (Nit) and o...
Due to the increased physical dielectric thickness and reduced gate leakage in metal-gate/high-k dev...
Hot electron induced degradation in 0.25 {micro}m, n-channel MOSFETs annealed in H{sub 2} or D{sub 2...
Metal-Nitride-Semiconductor FETs with channel lengths down to 100 nm & anovel Jet Vapor Deposite...
Metal-nitride-semiconductor FETs (MNSFETs) having channel lengths down to 100 mm and a novel jet vap...
Metal-nitride-semiconductor FETs (MNSFETs) having channel lengths down to 100 mm and a novel jet vap...
Conventional interface characterization techniques, such as charge pumping, cannot be applied to SOI...
Metal-nitride-semiconductor (MNS) FETs with channel lengths down to 100 nm with a novel jet vapor de...
In this paper, we study the reliability of n-channel Metal-Nitride-Silicon FETs fabricated using ult...
In this paper, we study the stress voltage polarity-dependent reliability of n-channel metal-nitride...
session posterInternational audienceThe HC degradation of nanoscale FD-SOI n-MOSFETs has been invest...
Abstract—In this paper, we study the stress voltage polarity-de-pendent reliability of n-channel met...
We have studied high field degradation of Jet Vapor Deposited (JVD) silicon nitride MNSFETs with DC ...
The hot-carrier degradation of deep-submicrometer LDD nMOSFETs under different gate-stress regimes i...
SOI MNSFETs with channel lengths down to 100 nm and having a Jet Vapor Deposited (JVD) silicon nitri...
The influence of channel length and oxide thickness on the hot-carrier induced interface (Nit) and o...
Due to the increased physical dielectric thickness and reduced gate leakage in metal-gate/high-k dev...
Hot electron induced degradation in 0.25 {micro}m, n-channel MOSFETs annealed in H{sub 2} or D{sub 2...