This paper discusses the effect of tool wear on surface finish in single-point diamond turning of single crystal silicon. The morphology and topography of the machined surface clearly show the type of cutting edge wear reproduced onto the cutting grooves. Scanning electron microscopy is used in order to correlate the cutting edge damage and microtopography features observed through atomic force microscopy. The possible wear mechanisms affecting tool performance and surface generation during cutting are also discussed. The zero degree rake angle single point diamond tool presented small nicks on the cutting edge. The negative rake angle tools presented more a type of crater wear on the rake face. No wear was detected on flank face of the dia...
Tool wear not only changes its geometry accuracy and integrity, but also decrease machining precisio...
This paper describes a parametric analysis of nanosurface generation in single-point diamond turning...
The interdependence of process parameters on diamond turning of single-crystal silicon is poorly und...
AbstractSingle point diamond turning (SPDT) of large functional surfaces on silicon remains a challe...
Single point diamond turning (SPDT) of large functional surfaces on silicon remains a challenge owin...
In this paper, a molecular dynamics simulation has been adopted to arrive at a phenomenological unde...
This paper presents an investigation of the effect of tool rake angle in single point diamond turnin...
The research described in this paper is a continuation of the collaborative efforts by Lawrence Live...
In the present study investigation was done to analyze the tool life by analyzing the change in surf...
Some material aspects such as grain size, purity and anisotropy exert an important influence on surf...
Silicon like any hard and brittle material is well known for its low machinability unless it is mach...
Ultraprecision, single point diamond turning (SPDT) is a tool based machining technology that allows...
ABSTRACT In the present study investigation was done to analyze the tool life by analyzing the chang...
An empirical study was conducted to evaluate cutting fluids for Single Point Diamond Turning (SPDT) ...
The objective of this paper is to show the dependence relationship between the crystallographic orie...
Tool wear not only changes its geometry accuracy and integrity, but also decrease machining precisio...
This paper describes a parametric analysis of nanosurface generation in single-point diamond turning...
The interdependence of process parameters on diamond turning of single-crystal silicon is poorly und...
AbstractSingle point diamond turning (SPDT) of large functional surfaces on silicon remains a challe...
Single point diamond turning (SPDT) of large functional surfaces on silicon remains a challenge owin...
In this paper, a molecular dynamics simulation has been adopted to arrive at a phenomenological unde...
This paper presents an investigation of the effect of tool rake angle in single point diamond turnin...
The research described in this paper is a continuation of the collaborative efforts by Lawrence Live...
In the present study investigation was done to analyze the tool life by analyzing the change in surf...
Some material aspects such as grain size, purity and anisotropy exert an important influence on surf...
Silicon like any hard and brittle material is well known for its low machinability unless it is mach...
Ultraprecision, single point diamond turning (SPDT) is a tool based machining technology that allows...
ABSTRACT In the present study investigation was done to analyze the tool life by analyzing the chang...
An empirical study was conducted to evaluate cutting fluids for Single Point Diamond Turning (SPDT) ...
The objective of this paper is to show the dependence relationship between the crystallographic orie...
Tool wear not only changes its geometry accuracy and integrity, but also decrease machining precisio...
This paper describes a parametric analysis of nanosurface generation in single-point diamond turning...
The interdependence of process parameters on diamond turning of single-crystal silicon is poorly und...