During dynamic tensile extrusion (DTE) the material is subjected to a complex deformation history, including high strain rates, large strains and elevated temperatures. This technique provides unique means to explore material performance under extreme conditions. In this work, the microstructural evolution of 99.98% commercially pure copper during the DTE test was investigated by means of electron backscatter diffraction (EBSD). The investigation was focused on the segment of the extruded jet that remained in the die, since numerical simulation showed that material points along the longitudinal axis of such segment correspond to different stages of a common temperature compensated deformation history. Therefore, post mortem microstructure i...
In-situ electron backscattering diffraction was used to track microstructure and texture development...
When copper is deformed to high plastic strain (γ 3 4) at high strain rates (γ 104s-1 a mi...
The evolution of dislocation storage in deformed copper was studied with cross-correlation-based hig...
During dynamic tensile extrusion (DTE) the material is subjected to a complex deformation history, i...
At high strain rates, deformation processes are essentially adiabatic and if the plastic work is lar...
The dynamic tensile extrusion (DTE) test offers unique possibility to probe material response under ...
A recently developed severe plastic deformation technique, cyclic expansion-extrusion (CEE), was app...
The dynamic tensile extrusion (DTE) behavior and microstructural evolution of fine-grained (FG, ~1 μ...
Samples of oxygen-free high conductivity (OFHC) coarse-grained (CG) and ultrafine-grained (UFG) copp...
Discontinuous dynamic recrystallization can occur during dynamic tensile extrusion of copper, which ...
Partial recrystallization of highly deformed polycrystalline aggregates creates a bimodal grain size...
Transition of dislocation structures in ultrafine-grained copper processed by simple shear extrusion...
Due to the character of the original source materials and the nature of batch digitization, quality ...
© 2018 by the authors. In this study, for the first time, the effect of large non-monotonic simple s...
Oxygen free electronic copper, 99.995% purity, of two initial grain sizes, 50 {mu}m and 100 {mu}m, h...
In-situ electron backscattering diffraction was used to track microstructure and texture development...
When copper is deformed to high plastic strain (γ 3 4) at high strain rates (γ 104s-1 a mi...
The evolution of dislocation storage in deformed copper was studied with cross-correlation-based hig...
During dynamic tensile extrusion (DTE) the material is subjected to a complex deformation history, i...
At high strain rates, deformation processes are essentially adiabatic and if the plastic work is lar...
The dynamic tensile extrusion (DTE) test offers unique possibility to probe material response under ...
A recently developed severe plastic deformation technique, cyclic expansion-extrusion (CEE), was app...
The dynamic tensile extrusion (DTE) behavior and microstructural evolution of fine-grained (FG, ~1 μ...
Samples of oxygen-free high conductivity (OFHC) coarse-grained (CG) and ultrafine-grained (UFG) copp...
Discontinuous dynamic recrystallization can occur during dynamic tensile extrusion of copper, which ...
Partial recrystallization of highly deformed polycrystalline aggregates creates a bimodal grain size...
Transition of dislocation structures in ultrafine-grained copper processed by simple shear extrusion...
Due to the character of the original source materials and the nature of batch digitization, quality ...
© 2018 by the authors. In this study, for the first time, the effect of large non-monotonic simple s...
Oxygen free electronic copper, 99.995% purity, of two initial grain sizes, 50 {mu}m and 100 {mu}m, h...
In-situ electron backscattering diffraction was used to track microstructure and texture development...
When copper is deformed to high plastic strain (γ 3 4) at high strain rates (γ 104s-1 a mi...
The evolution of dislocation storage in deformed copper was studied with cross-correlation-based hig...