This paper presents a 110–170 GHz direct conversion I/Q modulator realized in 130 nm SiGe BiCMOS technology with ft/fmax values of 250 GHz/ 370 GHz. The design is based on double-balanced Gilbert mixer cells with on-chip quadrature LO phase shifter and RF balun. In single-sideband operation, the modulator exhibits up to 9.5 dB conversion gain and has measured 3 dB IF bandwidth of 12 GHz. The measured image rejection ratio and LO to RF isolation are as high as 20 dB and 31 dB respectively. Measured input P1dB is −17 dBm at 127 GHz output. The dc power consumption is 53 mW. The active chip area is 620 pm∗ 480 pm including the RF and LO baluns. The circuit is capable of transmitting more than 12 Gbit/s QPSK signal
This paper presents a wideband 2 ×13-bit in-phase/quadrature-phase (I/Q) RF digital-to-analog conver...
Today’s main driving parameter for radio transceiver research is the ability to provide high capacit...
This paper presents a 140 GHz transmitter chipset realized in a 130 nm SiGe BiCMOS technology with f...
This paper presents a 110–170 GHz direct conversion I/Q modulator realized in 130 nm SiGe BiCMOS tec...
This paper presents a 110-170 GHz direct conversion I/Q modulator realized in 130 nm SiGe BiCMOS tec...
This paper presents the design and characterization of a D-band (110–170 GHz) monolithic microwave i...
A direct carrier IQ modulator operating in the 80-95 GHz frequency range is presented. The circuit i...
This paper presents design and characterization of single-chip 110-170 GHz (D-band) direct conversio...
A 60 GHz direct carrier quadrature modulator is designed and fabricated in 0.15 μm mHEMT technology....
This letter presents the design of a 200-250-GHz compact vector modulator (VM) phase shifter in a 0....
This paper presents design and characterization of D-band (110-170 GHz) monolithic microwave integra...
Millimeter waves are finding increasing applications in data communication, sensing,imaging and radi...
This paper presents a wideband 2 13-bit in-phase/quadrature-phase (I/Q) RF digital-to-analog convert...
This paper presents design and characterization of single-chip 110–170-GHz ( -band) direct conversio...
This paper presents a millimeter-wave (mmWave)direct quadrature modulator in 0.25μm InP DHBT technol...
This paper presents a wideband 2 ×13-bit in-phase/quadrature-phase (I/Q) RF digital-to-analog conver...
Today’s main driving parameter for radio transceiver research is the ability to provide high capacit...
This paper presents a 140 GHz transmitter chipset realized in a 130 nm SiGe BiCMOS technology with f...
This paper presents a 110–170 GHz direct conversion I/Q modulator realized in 130 nm SiGe BiCMOS tec...
This paper presents a 110-170 GHz direct conversion I/Q modulator realized in 130 nm SiGe BiCMOS tec...
This paper presents the design and characterization of a D-band (110–170 GHz) monolithic microwave i...
A direct carrier IQ modulator operating in the 80-95 GHz frequency range is presented. The circuit i...
This paper presents design and characterization of single-chip 110-170 GHz (D-band) direct conversio...
A 60 GHz direct carrier quadrature modulator is designed and fabricated in 0.15 μm mHEMT technology....
This letter presents the design of a 200-250-GHz compact vector modulator (VM) phase shifter in a 0....
This paper presents design and characterization of D-band (110-170 GHz) monolithic microwave integra...
Millimeter waves are finding increasing applications in data communication, sensing,imaging and radi...
This paper presents a wideband 2 13-bit in-phase/quadrature-phase (I/Q) RF digital-to-analog convert...
This paper presents design and characterization of single-chip 110–170-GHz ( -band) direct conversio...
This paper presents a millimeter-wave (mmWave)direct quadrature modulator in 0.25μm InP DHBT technol...
This paper presents a wideband 2 ×13-bit in-phase/quadrature-phase (I/Q) RF digital-to-analog conver...
Today’s main driving parameter for radio transceiver research is the ability to provide high capacit...
This paper presents a 140 GHz transmitter chipset realized in a 130 nm SiGe BiCMOS technology with f...