Capacitance-voltage [C(V)] measurements of metal-insulator-semiconductor-heterostructure capacitors are used to investigate the interface between silicon nitride passivation and AlGaN/AlN/GaN heterostructure material. AlGaN/AlN/GaN samples having different silicon nitride passivating layers, deposited using three different deposition techniques, are evaluated. Different interface state distributions result in large differences in the C(V) characteristics. A method to extract fixed charge as well as traps from the C(V) characteristics is presented. Rough estimates of the emission time constants of the traps can be extracted by careful analysis of the C(V) characteristics. The fixed charge is positive for all samples, with a density varying b...
This study presents a detailed analysis of the Plasma-enhanced chemical vapour deposition (PECVD) si...
(Ni/Au)Alx Ga1-x N/AlN/GaN(x = 0.22) heterostructures with and without a passivation layer of the Si...
Fixed charge and surface traps at the passivation/semiconductor interface play a major role in both ...
Capacitance-voltage [C(V)] measurements of metal-insulator-semiconductor-heterostructure capacitors ...
The large bandgap of gallium nitride (GaN) and aluminum gallium nitride (AlGaN) offers an inherently...
The large bandgap of gallium nitride (GaN) and aluminum gallium nitride (AlGaN) offers an inherently...
With the rapid improvement of nitride semiconductor epitaxial growth technology, the precise and acc...
We present an analysis method for GaN-based metal-insulator-semiconductor (MIS) devices by using cap...
AlN/AlGaN/GaN metal-insulator-semiconductor(MIS) structure is analyzed by using capacitance-frequenc...
This paper analyses the influence of the GaN and Si3N4 passivation (or "cap") layer on the top of th...
This paper analyses the influence of the GaN and Si3N4 passivation (or "cap") layer on the top of th...
The physical mechanism of passivation of AlGaN/GaN HEMTs by AlN thin film prepared with plasma-enhan...
Electrical characterization of SiO2/n-GaN metal-insulator-semiconductor structures fabricated on sap...
Recent years have witnessed GaN-based devices delivering their promise of unprecedented power and fr...
In this study, conventional multiple-frequency capacitance–voltage (C-V) curves of a metal-insulator...
This study presents a detailed analysis of the Plasma-enhanced chemical vapour deposition (PECVD) si...
(Ni/Au)Alx Ga1-x N/AlN/GaN(x = 0.22) heterostructures with and without a passivation layer of the Si...
Fixed charge and surface traps at the passivation/semiconductor interface play a major role in both ...
Capacitance-voltage [C(V)] measurements of metal-insulator-semiconductor-heterostructure capacitors ...
The large bandgap of gallium nitride (GaN) and aluminum gallium nitride (AlGaN) offers an inherently...
The large bandgap of gallium nitride (GaN) and aluminum gallium nitride (AlGaN) offers an inherently...
With the rapid improvement of nitride semiconductor epitaxial growth technology, the precise and acc...
We present an analysis method for GaN-based metal-insulator-semiconductor (MIS) devices by using cap...
AlN/AlGaN/GaN metal-insulator-semiconductor(MIS) structure is analyzed by using capacitance-frequenc...
This paper analyses the influence of the GaN and Si3N4 passivation (or "cap") layer on the top of th...
This paper analyses the influence of the GaN and Si3N4 passivation (or "cap") layer on the top of th...
The physical mechanism of passivation of AlGaN/GaN HEMTs by AlN thin film prepared with plasma-enhan...
Electrical characterization of SiO2/n-GaN metal-insulator-semiconductor structures fabricated on sap...
Recent years have witnessed GaN-based devices delivering their promise of unprecedented power and fr...
In this study, conventional multiple-frequency capacitance–voltage (C-V) curves of a metal-insulator...
This study presents a detailed analysis of the Plasma-enhanced chemical vapour deposition (PECVD) si...
(Ni/Au)Alx Ga1-x N/AlN/GaN(x = 0.22) heterostructures with and without a passivation layer of the Si...
Fixed charge and surface traps at the passivation/semiconductor interface play a major role in both ...