The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of modern microsystem demands. Carbon nanotube (CNT) has been proven to be a potential material for micro-cooler because of its superior advantages including high thermal conductivity, good mechanical property and so forth. And there emerges various applications of CNT in the micro-cooler system. In the present paper, micro-pin-fin heat sink with gas impinging jet as the cooling medium is analyzed. The heat dissipation of forced air convection cooling with micro-pin-fin structures made of aligned carbon nanotube arrays has been taken into consideration. The three-dimensional computational fluid dynamics (CFD) simulation was carried out. The tempe...
In this report, four different strategies to enhance the cooling performance of a micro pin fin heat...
The hydraulic and thermal performance of microchannel heat sink configurations for high performance ...
The effect of the pin-fin shapes on the overall performance of the carbon nanotube bundles as porous...
Micro-pin-fin cooler mounted on the power chip enables the heat removal to meet modern microsystem r...
The current development of electronic products towards miniaturization and multifunction is leading ...
Heat removing from a microelectronic chip packaging has grand effect on performance and durability o...
Carbon nanotubes (CNTs) have shown a broad promising application in high mechanical strength and ele...
Heat dissipation is one of the factors limiting the continuous miniaturization of electronics. In th...
Cooling of microsystem electronic device is of great importance, according to increased heat dissipa...
Carbon nanotube (CNT) is considered as an ideal material for thermal management in electronic packag...
With the continuously increasing packaging density, the corresponding techniques for heat dissipatio...
The continuously increasing integration and packaging density of microelectronic systems requires hi...
New electronic devices are faster than ever before, incorporate a higher level of integration, and a...
The microchannel heat sink (MCHS) has been established as an effective heat removal system in electr...
In this work, silicon microchannel coolers were made using the Deep Ion Reactive Etching (DIRE) tech...
In this report, four different strategies to enhance the cooling performance of a micro pin fin heat...
The hydraulic and thermal performance of microchannel heat sink configurations for high performance ...
The effect of the pin-fin shapes on the overall performance of the carbon nanotube bundles as porous...
Micro-pin-fin cooler mounted on the power chip enables the heat removal to meet modern microsystem r...
The current development of electronic products towards miniaturization and multifunction is leading ...
Heat removing from a microelectronic chip packaging has grand effect on performance and durability o...
Carbon nanotubes (CNTs) have shown a broad promising application in high mechanical strength and ele...
Heat dissipation is one of the factors limiting the continuous miniaturization of electronics. In th...
Cooling of microsystem electronic device is of great importance, according to increased heat dissipa...
Carbon nanotube (CNT) is considered as an ideal material for thermal management in electronic packag...
With the continuously increasing packaging density, the corresponding techniques for heat dissipatio...
The continuously increasing integration and packaging density of microelectronic systems requires hi...
New electronic devices are faster than ever before, incorporate a higher level of integration, and a...
The microchannel heat sink (MCHS) has been established as an effective heat removal system in electr...
In this work, silicon microchannel coolers were made using the Deep Ion Reactive Etching (DIRE) tech...
In this report, four different strategies to enhance the cooling performance of a micro pin fin heat...
The hydraulic and thermal performance of microchannel heat sink configurations for high performance ...
The effect of the pin-fin shapes on the overall performance of the carbon nanotube bundles as porous...