The current development of electronic products towards miniaturization and multifunction is leading to an increase in the power density of chip and IC. The high power consumption and corresponding heat dissipation are two of the most serious limitations for high performance electronics. The combination of the carbon nanotube (CNT) with outstanding thermal properties with an air jet cooling provides a promising option for the heat dissipation of high-powered components and devices. In the present paper, the CNTs are utilized to manufacture the pin-fins for the micro-cooler, and the performance and evaluation of this CNT-based micro-pin-fin cooler are investigated both experimentally and numerically. The effects of various parameters, such as...
Copyright © 2013 Bui HungThang et al.This is an open access article distributed under theCreativeCom...
Coolants play a major role in the performance of heat exchanging systems. In a marine gas turbine en...
Nanofluids with their enhanced thermal conductivity are believed to be a promising coolant in heat t...
The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of m...
Micro-pin-fin cooler mounted on the power chip enables the heat removal to meet modern microsystem r...
Heat removing from a microelectronic chip packaging has grand effect on performance and durability o...
Carbon nanotubes (CNTs) have shown a broad promising application in high mechanical strength and ele...
With the continuously increasing packaging density, the corresponding techniques for heat dissipatio...
Heat dissipation is one of the factors limiting the continuous miniaturization of electronics. In th...
The continuously increasing integration and packaging density of microelectronic systems requires hi...
Carbon nanotube (CNT) is considered as an ideal material for thermal management in electronic packag...
Cooling of microsystem electronic device is of great importance, according to increased heat dissipa...
In this work, silicon microchannel coolers were made using the Deep Ion Reactive Etching (DIRE) tech...
As the integrity of micro electronic devices improves, the heat power of chips is getting higher and...
Carbon nanotubes (CNTs) have shown great potential of application in electronics because of their at...
Copyright © 2013 Bui HungThang et al.This is an open access article distributed under theCreativeCom...
Coolants play a major role in the performance of heat exchanging systems. In a marine gas turbine en...
Nanofluids with their enhanced thermal conductivity are believed to be a promising coolant in heat t...
The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of m...
Micro-pin-fin cooler mounted on the power chip enables the heat removal to meet modern microsystem r...
Heat removing from a microelectronic chip packaging has grand effect on performance and durability o...
Carbon nanotubes (CNTs) have shown a broad promising application in high mechanical strength and ele...
With the continuously increasing packaging density, the corresponding techniques for heat dissipatio...
Heat dissipation is one of the factors limiting the continuous miniaturization of electronics. In th...
The continuously increasing integration and packaging density of microelectronic systems requires hi...
Carbon nanotube (CNT) is considered as an ideal material for thermal management in electronic packag...
Cooling of microsystem electronic device is of great importance, according to increased heat dissipa...
In this work, silicon microchannel coolers were made using the Deep Ion Reactive Etching (DIRE) tech...
As the integrity of micro electronic devices improves, the heat power of chips is getting higher and...
Carbon nanotubes (CNTs) have shown great potential of application in electronics because of their at...
Copyright © 2013 Bui HungThang et al.This is an open access article distributed under theCreativeCom...
Coolants play a major role in the performance of heat exchanging systems. In a marine gas turbine en...
Nanofluids with their enhanced thermal conductivity are believed to be a promising coolant in heat t...