Low stress polyimide multilayers integration for flexible substrate

International audienceMaterials integration in flexible substrate to do foldable and bending MEMS or electronics devices seems to be required for a lot of applications. That's why; we present here a simple fabrication process flow to make polyimide (PI) devices easily peelable from a rigid support host. Besides the PI flexible device keeps its original aspect thanks to the hygroscopic character of the carrier [1]. The advantage of this process is its simplicity of implementation on a support host without sacrificial layer. It makes it possible to control roughness, deposited thickness, and also to limit the constraints between various materials