13301甲第4239号博士（工学）金沢大学博士論文要旨Abstract 以下に掲載予定：Advanced Materials Research 1101(III) pp.412-418 2015-05. Trans Tech Publication Ltd. 共著者：Alias Mohd Saman, Tatsuaki Furumoto, Akira Hosokawa, Takashi Ued
A damage morphology study was performed with a 355 nm Nd:YAG laser on synthetic UV-grade fused silic...
Wafer dicing is the technology to separate wafers into divided components known as dies. New develop...
The laser microdrilling of via holes in Si semiconductor wafers was studied using 1 ms pulses from a...
Laser cleaving process is a prospective technique to divide a thin plate of brittle materials into s...
The thermal stress cleaving of silicon wafer with a laser beam is a prospective technique, which sup...
The key problems associated with laser processing of ceramics are centred on the induction of high t...
金沢大学理工研究域機械工学系Laser cleaving is a prospective technique for separating a wafer or thin plate from br...
金沢大学理工研究域機械工学系Thermal stress cleaving is a prospective technique for separating a wafer or thin plat...
An optimal condition of thermal stress cleaving was investigated by assuming the element-by-element ...
During laser cleaving of brittle materials, with the controlled fracture technique, thermal stresses...
AbstractLaser Augmented Diamond Drilling (LADD) is a new technique to drill hard and brittle materia...
When a nanosecond pulse laser is irradiated into a single crystal silicon, a local area near the foc...
The paper presented a technical study on laser (light amplification by stimulated emission of radiat...
During laser cleaving of brittle materials, with the controlled fracture technique, thermal stresses...
Laser shock peening can significantly improve the fatigue life of metals by introducing plastic defo...
A damage morphology study was performed with a 355 nm Nd:YAG laser on synthetic UV-grade fused silic...
Wafer dicing is the technology to separate wafers into divided components known as dies. New develop...
The laser microdrilling of via holes in Si semiconductor wafers was studied using 1 ms pulses from a...
Laser cleaving process is a prospective technique to divide a thin plate of brittle materials into s...
The thermal stress cleaving of silicon wafer with a laser beam is a prospective technique, which sup...
The key problems associated with laser processing of ceramics are centred on the induction of high t...
金沢大学理工研究域機械工学系Laser cleaving is a prospective technique for separating a wafer or thin plate from br...
金沢大学理工研究域機械工学系Thermal stress cleaving is a prospective technique for separating a wafer or thin plat...
An optimal condition of thermal stress cleaving was investigated by assuming the element-by-element ...
During laser cleaving of brittle materials, with the controlled fracture technique, thermal stresses...
AbstractLaser Augmented Diamond Drilling (LADD) is a new technique to drill hard and brittle materia...
When a nanosecond pulse laser is irradiated into a single crystal silicon, a local area near the foc...
The paper presented a technical study on laser (light amplification by stimulated emission of radiat...
During laser cleaving of brittle materials, with the controlled fracture technique, thermal stresses...
Laser shock peening can significantly improve the fatigue life of metals by introducing plastic defo...
A damage morphology study was performed with a 355 nm Nd:YAG laser on synthetic UV-grade fused silic...
Wafer dicing is the technology to separate wafers into divided components known as dies. New develop...
The laser microdrilling of via holes in Si semiconductor wafers was studied using 1 ms pulses from a...
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