Analysis of electromagnetic shielding of IC package with thin absorbing material coating inside in two different configurations

This paper focuses the application of absorbing material in Integrated Circuits (IC), proposed that IC package coated absorbing material inside can suppress the electromagnetic interference (EMI) in IC chip which caused by the outside complex electromagnetic environment, as well as reducing the electromagnetic radiation caused by chip itself. This proposal is well demonstrated by finite difference time-domain (FDTD) method. Two different configurations of thin absorbing material coating, “Single” and “Double”, are studied in this paper. In the first of simulation, the complex electromagnetic environment is modeled as the Gaussian incident plane wave; in the second, two adjacent pins are chosen as signal port and ground port, to simulate the electromagnetic radiation caused by chip. Finally, to analyze the performance of absorbing material by comparing shielding effectiveness (SE). The analysis process can provide for IC chip electromagnetic compatibility (EMC).No Full Tex