Pulse-reverse power modes are used in galvanotechniques in order to obtain coatings with better characteristics in terms of gloss, adhesion, tracking sharp edges and uniform distribution of deposits on complex shape objects, compared with the coatings produced by constant current modes. Pulse-reverse modes also allow the use of a higher current density, and thus the production speed of electroplating cells increases. Systems for standard electroplating of copper, silver and gold are optimised by the suitable choice of duration and intensity of the pulses. It is shown that coatings with satisfactory quality can be deposited using higher current density, different modes of pulsed current in a very short period of time, without expensive and o...
This work investigates the feasibility of increasing the electric conductivity of an AA1370 aluminiu...
Plating process is one of the most critical steps in the manufacturing process of PCB. The thickness...
This study has examined the pulse electrodeposition of copper from a deep eutectic solvent. Pulse pl...
Pulse-reverse power modes are used in galvanotechniques in order to obtain coatings with better char...
Pulse-reverse power modes are used in galvanotechniques in order to obtain coatings with better char...
Pulse-reverse power modes are used in galvanotechniques in order to obtain coatings with better char...
The electrodeposition of metals using pulsed current has achieved practical importance in recent yea...
This thesis is concerned with the study of square wave unipolar pulse and bipolar pulse reverse elec...
Electroplating is a common method of obtaining metallic coatings on a surface. Generally, the metal ...
Electroplating is a common method of obtaining metallic coatings on a surface. Generally, the metal ...
Surface Technology and in particular, Electroplating, is a key, across-the-board discipline without ...
Surface Technology and in particular, Electroplating, is a key, across-the-board discipline without ...
Electroplating is a common method of obtaining metallic coatings on a surface. Generally, the metal ...
Process of electrochemical deposition of copper on a steel and iron substrate from citrate electroly...
This research was concerned with the effects of pulsed current on the electrodeposition of chromium ...
This work investigates the feasibility of increasing the electric conductivity of an AA1370 aluminiu...
Plating process is one of the most critical steps in the manufacturing process of PCB. The thickness...
This study has examined the pulse electrodeposition of copper from a deep eutectic solvent. Pulse pl...
Pulse-reverse power modes are used in galvanotechniques in order to obtain coatings with better char...
Pulse-reverse power modes are used in galvanotechniques in order to obtain coatings with better char...
Pulse-reverse power modes are used in galvanotechniques in order to obtain coatings with better char...
The electrodeposition of metals using pulsed current has achieved practical importance in recent yea...
This thesis is concerned with the study of square wave unipolar pulse and bipolar pulse reverse elec...
Electroplating is a common method of obtaining metallic coatings on a surface. Generally, the metal ...
Electroplating is a common method of obtaining metallic coatings on a surface. Generally, the metal ...
Surface Technology and in particular, Electroplating, is a key, across-the-board discipline without ...
Surface Technology and in particular, Electroplating, is a key, across-the-board discipline without ...
Electroplating is a common method of obtaining metallic coatings on a surface. Generally, the metal ...
Process of electrochemical deposition of copper on a steel and iron substrate from citrate electroly...
This research was concerned with the effects of pulsed current on the electrodeposition of chromium ...
This work investigates the feasibility of increasing the electric conductivity of an AA1370 aluminiu...
Plating process is one of the most critical steps in the manufacturing process of PCB. The thickness...
This study has examined the pulse electrodeposition of copper from a deep eutectic solvent. Pulse pl...