In metal electrodeposition in the limiting diffusion current density range the deposition current density remains constant regardless of the deposition overpotential used. At the same time, the larger the deposition overpotential is the more disperse is the formed deposit, which is characterised by an increased specific surface. The difference in the specific surface of disperse deposits obtained at two different overpotentials in the limiting diffusion current density range is correlated with the difference between the deposition overpotentials. A method for the estimation of the surface tension of solid copper in copper sulfate solutions is also proposed.Granična difuziona struja kod elektrohemijskog taloženja metala ne zavisi od primenje...
Studies were made of Cu electrodeposited onto a (111) plane of a Cu single crystal from an acidic Cu...
Observations of copper electrodeposits on to the (100) plane of copper was made from highly purified...
Studies were made of the electrodeposition of Cu onto a single-crystal Cu(100) plane and onto a pol...
In metal electrodeposition in the limiting diffusion current density range the deposition current de...
In metal electrodeposition in the limiting diffusion current density range, the deposition current d...
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plat...
The specific surface of electrodeposited copper was determined using recently proposed way for the e...
Apossible way for the estimation of the interfacial energy of the copper – copper sulphate solution ...
A possible way for the estimation of the interfacial energy of the copper - copper sulphate solution...
Electrodeposition of copper from acid sulfate solutions at overpotentials on the plateau of the limi...
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plat...
This a review paper considering fundamental aspects of copper electrodeposition at high overpotentia...
Studies were made of copper, electrodeposited on to the (100) plane of copper from highly purified s...
In this chapter, the fundamental aspects of disperse metals electrodeposition are discussed. The sha...
Copper electrodeposition on copper from still plating solutions of different compositions was invest...
Studies were made of Cu electrodeposited onto a (111) plane of a Cu single crystal from an acidic Cu...
Observations of copper electrodeposits on to the (100) plane of copper was made from highly purified...
Studies were made of the electrodeposition of Cu onto a single-crystal Cu(100) plane and onto a pol...
In metal electrodeposition in the limiting diffusion current density range the deposition current de...
In metal electrodeposition in the limiting diffusion current density range, the deposition current d...
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plat...
The specific surface of electrodeposited copper was determined using recently proposed way for the e...
Apossible way for the estimation of the interfacial energy of the copper – copper sulphate solution ...
A possible way for the estimation of the interfacial energy of the copper - copper sulphate solution...
Electrodeposition of copper from acid sulfate solutions at overpotentials on the plateau of the limi...
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plat...
This a review paper considering fundamental aspects of copper electrodeposition at high overpotentia...
Studies were made of copper, electrodeposited on to the (100) plane of copper from highly purified s...
In this chapter, the fundamental aspects of disperse metals electrodeposition are discussed. The sha...
Copper electrodeposition on copper from still plating solutions of different compositions was invest...
Studies were made of Cu electrodeposited onto a (111) plane of a Cu single crystal from an acidic Cu...
Observations of copper electrodeposits on to the (100) plane of copper was made from highly purified...
Studies were made of the electrodeposition of Cu onto a single-crystal Cu(100) plane and onto a pol...