Convenient Adhesive Strength Evaluation Method in Terms of the Intensity of Singular Stress Field

A convenient evaluation method is proposed for the debonding adhesive strength in terms of the intensity of singular stress field (ISSF) appearing at the end of interface. The same FEM mesh pattern is applied to unknown problems and reference problems. It is found that the ISSF is obtained accurately by focussing on the FEM stress at the adhesive corner. Then, the debonding condition can be expressed as a constant value of critical ISSF. The usefulness of the present solution is verified by comparing with the results of the conventional method