Separating the substrate allows thin layers of III-V photonic semiconductor materials and devices to be integrated on foreign templates using transfer-printing. We demonstrate advanced light emitting and detecting devices based on this principle
Transfer-printing provides a highly versatile methodology to heterogeneously and intimately integrat...
We demonstrate the transfer-printing-based integration of III-V substrate-illuminated p-i-n photodet...
The work presented in this thesis focuses on the transfer printing of InGaN-based blue emitting ligh...
Separating the substrate allows thin layers of III-V photonic semiconductor materials and devices to...
For the first time, III-V opto-electronic components are coupled to silicon waveguide circuits using...
An electrically pumped DFB laser integrated on and coupled to a silicon waveguide circuit is demonst...
The essential functionality of photonic and electronic devices is contained in thin surface layers l...
Transfer printing is an enabling technology for the efficient integration of III-V semiconductor dev...
Micro-transfer-printing is a key enabling technology for the heterogeneous integration of different ...
We report on the integration by transfer printing of III-V Fabry-Perot cavities on a silicon photoni...
Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior perfo...
Optical systems require the integration of technologies fabricated on different materials. We use a ...
We report on the heterogeneous integration of electrically pumped InP Fabry-Perot lasers on a SOI ph...
Photonic integrated circuits (PICs), implementing optical functions such as light generation, modula...
The vertical micro-assembly of membrane photonic devices across a range of materials is presented, i...
Transfer-printing provides a highly versatile methodology to heterogeneously and intimately integrat...
We demonstrate the transfer-printing-based integration of III-V substrate-illuminated p-i-n photodet...
The work presented in this thesis focuses on the transfer printing of InGaN-based blue emitting ligh...
Separating the substrate allows thin layers of III-V photonic semiconductor materials and devices to...
For the first time, III-V opto-electronic components are coupled to silicon waveguide circuits using...
An electrically pumped DFB laser integrated on and coupled to a silicon waveguide circuit is demonst...
The essential functionality of photonic and electronic devices is contained in thin surface layers l...
Transfer printing is an enabling technology for the efficient integration of III-V semiconductor dev...
Micro-transfer-printing is a key enabling technology for the heterogeneous integration of different ...
We report on the integration by transfer printing of III-V Fabry-Perot cavities on a silicon photoni...
Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior perfo...
Optical systems require the integration of technologies fabricated on different materials. We use a ...
We report on the heterogeneous integration of electrically pumped InP Fabry-Perot lasers on a SOI ph...
Photonic integrated circuits (PICs), implementing optical functions such as light generation, modula...
The vertical micro-assembly of membrane photonic devices across a range of materials is presented, i...
Transfer-printing provides a highly versatile methodology to heterogeneously and intimately integrat...
We demonstrate the transfer-printing-based integration of III-V substrate-illuminated p-i-n photodet...
The work presented in this thesis focuses on the transfer printing of InGaN-based blue emitting ligh...
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