Electronic components generate large amount of heat during their operation, which requires to be dissipated. Over the past decade, internal heat generation levels have exponentially increased due to the compact packaging of high-powered microelectronic circuitry in modern devices. The efficient removal of this internally generated heat from microelectronic components is a critical design consideration for enabling optimum performance, and improving the operational reliability of modern high-performance electronic devices. Traditional cooling techniques such as fan-cooled heat sinks are grossly inadequate, and impose severe limits on product design, and hence cannot be used for cooling modern electronic components. Microchannel based cooling...
The hydraulic and thermal performance of microchannel heat sink configurations for high performance ...
Microchannel heat transfer is commonly applied in the thermal management of high-power electronics. ...
MEMS heat sink having wavy microchannels integrating circular pin-fins for cooling of microelectroni...
Efficient cooling techniques are one of the critical design requirements for maintaining reliable op...
This paper examines the thermal behaviour of fluid flow through a microchannel that incorporates fou...
A highly efficient thermal management is imperative to overcome the main challenges associated with ...
The ongoing evolution of electronic systems that operate under extreme conditions has led to persist...
A novel microchannel heat sink with oval-shaped micro pin fins (MOPF) is proposed and the characteri...
Microchannel technology rapidly established itself as a practicable solution to the problem of the r...
This paper presents a three-dimensional numerical study of steady, laminar, incompressible flow and ...
We report an extended surface technique that utilises micro-fin arrays to enhance the heat transfer ...
Purpose – To provide modeling approaches of increasing levels of complexity for the analysis of conv...
This work conceptualizes heat sinks for electronics employing wavy/sinusoidal microchannels embedded...
With the development of miniaturized and enormous heat density generating novel technologies, the mi...
As the world is shifting towards a digital era with advances in technology, demand for high-performa...
The hydraulic and thermal performance of microchannel heat sink configurations for high performance ...
Microchannel heat transfer is commonly applied in the thermal management of high-power electronics. ...
MEMS heat sink having wavy microchannels integrating circular pin-fins for cooling of microelectroni...
Efficient cooling techniques are one of the critical design requirements for maintaining reliable op...
This paper examines the thermal behaviour of fluid flow through a microchannel that incorporates fou...
A highly efficient thermal management is imperative to overcome the main challenges associated with ...
The ongoing evolution of electronic systems that operate under extreme conditions has led to persist...
A novel microchannel heat sink with oval-shaped micro pin fins (MOPF) is proposed and the characteri...
Microchannel technology rapidly established itself as a practicable solution to the problem of the r...
This paper presents a three-dimensional numerical study of steady, laminar, incompressible flow and ...
We report an extended surface technique that utilises micro-fin arrays to enhance the heat transfer ...
Purpose – To provide modeling approaches of increasing levels of complexity for the analysis of conv...
This work conceptualizes heat sinks for electronics employing wavy/sinusoidal microchannels embedded...
With the development of miniaturized and enormous heat density generating novel technologies, the mi...
As the world is shifting towards a digital era with advances in technology, demand for high-performa...
The hydraulic and thermal performance of microchannel heat sink configurations for high performance ...
Microchannel heat transfer is commonly applied in the thermal management of high-power electronics. ...
MEMS heat sink having wavy microchannels integrating circular pin-fins for cooling of microelectroni...