Stencil printing at sub-100 microns pitch
- Desmulliez, M.P.Y.
- Kay, R.W.
- Stoyanov, S.
- Bailey, C.
Publication date
January 2004
DOI Publisher
Institute of Electrical and Electronics Engineers (IEEE)Abstract
This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 leadfree solder pastes and conductive adhesives. The advantages of the microengineered stencil are presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described
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