The CMS Outer Tracker planned for the HL-LHC Upgrade contains strip-strip and pixel-strip silicon modules. Each of them includes two high-density front-end hybrid circuits, equipped with flip-chip ASICs, passives, connectors and mechanical structures. Several strip-strip hybrid prototypes have been produced using the CBC2 front-end ASIC. Feedback from these developments helped improving the hybrid's testability and the production yield. The availability of the concentrator ASIC's footprint and of the new CBC3 front-end ASIC enables the design of all strip-strip hybrid variants. In this work, the development milestones and the final designs are presented together with chosen solutions
More than twenty-five thousand hybrids will be produced for the CMS Outer Tracker Phase-2 Upgrade. T...
The CMS Binary Chip (CBC) is a prototype version of the front-end read-out ASIC to be used in the si...
The upgrade of the CMS tracker at the HL-LHC relies on hybrid modules built on high density intercon...
New high-density interconnect hybrid circuits are under development for the CMS tracker modules at t...
The upgrade of the CMS tracker for the HL-LHC is based on a binary readout scheme using the CMS Bina...
The upgrade of the CMS tracker at the HL-LHC requires the design of new front-end modules to cope wi...
The CMS tracker upgrade for the HL-LHC relies on different module types, depending on the position o...
The upgrade of the CMS Outer Tracker for the HL-LHC requires the design of new double-sensor modules...
For the HL-LHC, ATLAS [1] will install a new all-silicon tracking system. The strip part will be com...
For the HL-LHC, ATLAS [1] will install a new all-silicon tracking system. The strip part will be com...
At the High Luminosity LHC (HL-LHC), the CMS experiment will need to operate at up to 200 interactio...
At the High Luminosity LHC (HL-LHC), the CMS experiment will need to operate at up to 200 interactio...
The Large Hadron Collider (LHC) will undergo a major “High Luminosity” upgrade with the goal of deli...
High Density Interconnect hybrids are being developed for the CMS tracker Phase-2 upgrade for the HL...
The Concentrator Integrated Circuit (CIC) ASIC is a front-end chip for both Pixel-Strip (PS) and Str...
More than twenty-five thousand hybrids will be produced for the CMS Outer Tracker Phase-2 Upgrade. T...
The CMS Binary Chip (CBC) is a prototype version of the front-end read-out ASIC to be used in the si...
The upgrade of the CMS tracker at the HL-LHC relies on hybrid modules built on high density intercon...
New high-density interconnect hybrid circuits are under development for the CMS tracker modules at t...
The upgrade of the CMS tracker for the HL-LHC is based on a binary readout scheme using the CMS Bina...
The upgrade of the CMS tracker at the HL-LHC requires the design of new front-end modules to cope wi...
The CMS tracker upgrade for the HL-LHC relies on different module types, depending on the position o...
The upgrade of the CMS Outer Tracker for the HL-LHC requires the design of new double-sensor modules...
For the HL-LHC, ATLAS [1] will install a new all-silicon tracking system. The strip part will be com...
For the HL-LHC, ATLAS [1] will install a new all-silicon tracking system. The strip part will be com...
At the High Luminosity LHC (HL-LHC), the CMS experiment will need to operate at up to 200 interactio...
At the High Luminosity LHC (HL-LHC), the CMS experiment will need to operate at up to 200 interactio...
The Large Hadron Collider (LHC) will undergo a major “High Luminosity” upgrade with the goal of deli...
High Density Interconnect hybrids are being developed for the CMS tracker Phase-2 upgrade for the HL...
The Concentrator Integrated Circuit (CIC) ASIC is a front-end chip for both Pixel-Strip (PS) and Str...
More than twenty-five thousand hybrids will be produced for the CMS Outer Tracker Phase-2 Upgrade. T...
The CMS Binary Chip (CBC) is a prototype version of the front-end read-out ASIC to be used in the si...
The upgrade of the CMS tracker at the HL-LHC relies on hybrid modules built on high density intercon...