session 7: CharacterizationInternational audienceGDNMOS (Gated Diode merged NMOS) and GDBIMOS (Gated Diode merged BIMOS) were fabricated using the 28nm thin film UTBB FD-SOI CMOS technology. Different connectivity conditions were measured and simulated. The devices are reconfigurable and promising for ESD protection applications
One of the most pervasive reliability problems of the IC (integrated circuits) industry is the ESD (...
International audienceInnovative Ultra-Thin Body and Buried Oxide FDSOI protections (BBC-T and Z2-FE...
Abstract—One method to enhance electrostatic discharge (ESD) robustness of the on-chip ESD protectio...
session 7: CharacterizationInternational audienceGDNMOS (Gated Diode merged NMOS) and GDBIMOS (Gated...
International audienceWe propose a novel ESD protection device (GDNMOS: Gated Diode merged NMOS) fab...
session D: SoC, DFM.TCADInternational audienceThis paper presents a new device named the Gated Diode...
session 11: Advanced DevicesInternational audienceWe propose a novel device (GDNMOS: Gated Diode mer...
International audienceWe evaluate the Electro-Static Discharge (ESD) protection capability of BIpola...
session 2: POwer Devices and ESD ProtectionInternational audienceThe purpose of this study is to eva...
L’architecture FDSOI (silicium sur isolant totalement déserté) permet une amélioration significative...
The electrostatic discharge (ESD) protection is a major concern for advanced CMOS technology manufac...
A novel layout strategy for on-chip ESD protection application is presented to solve the non-uniform...
Layout strategies including source edge to substrate space (SESS) and inserted substrate-pick stripe...
Gate-grounded NMOS (ggNMOS) transistors have widely served as electro-static discharge (ESD) protect...
Gate-grounded NMOS(gg NMOS) transistors have widely served as electro-static discharge(ESD)protectio...
One of the most pervasive reliability problems of the IC (integrated circuits) industry is the ESD (...
International audienceInnovative Ultra-Thin Body and Buried Oxide FDSOI protections (BBC-T and Z2-FE...
Abstract—One method to enhance electrostatic discharge (ESD) robustness of the on-chip ESD protectio...
session 7: CharacterizationInternational audienceGDNMOS (Gated Diode merged NMOS) and GDBIMOS (Gated...
International audienceWe propose a novel ESD protection device (GDNMOS: Gated Diode merged NMOS) fab...
session D: SoC, DFM.TCADInternational audienceThis paper presents a new device named the Gated Diode...
session 11: Advanced DevicesInternational audienceWe propose a novel device (GDNMOS: Gated Diode mer...
International audienceWe evaluate the Electro-Static Discharge (ESD) protection capability of BIpola...
session 2: POwer Devices and ESD ProtectionInternational audienceThe purpose of this study is to eva...
L’architecture FDSOI (silicium sur isolant totalement déserté) permet une amélioration significative...
The electrostatic discharge (ESD) protection is a major concern for advanced CMOS technology manufac...
A novel layout strategy for on-chip ESD protection application is presented to solve the non-uniform...
Layout strategies including source edge to substrate space (SESS) and inserted substrate-pick stripe...
Gate-grounded NMOS (ggNMOS) transistors have widely served as electro-static discharge (ESD) protect...
Gate-grounded NMOS(gg NMOS) transistors have widely served as electro-static discharge(ESD)protectio...
One of the most pervasive reliability problems of the IC (integrated circuits) industry is the ESD (...
International audienceInnovative Ultra-Thin Body and Buried Oxide FDSOI protections (BBC-T and Z2-FE...
Abstract—One method to enhance electrostatic discharge (ESD) robustness of the on-chip ESD protectio...