The thermal management is an ever increasing challenge in advanced electronic devices. In this paper, simulation-based optimization is applied to improve the design of a plate-fin heat-sink in terms of operational cost and thermal performance. The proposed framework combines a conjugate heat transfer solver, a CAD engine and an adapted Sandwiching algorithm. A key feature is the use of novel immersed boundary (IB) techniques that allows for automated meshing which is perfectly suited for parametric design optimization
[[abstract]]An effective method for performing the thermal optimization of fully confined pin-fin he...
This work presents an exploration of fluid region optimization within coupled fluid–thermal problems...
Single and multi-objective thermal performance of heat sink are considered using evolutionary optimi...
The thermal management is an ever increasing challenge in advanced electronic devices. In this paper...
Fins and fin arrays with constant temperature at the fin base have known solutions for natural conve...
Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooli...
In this thesis the geometrical configuration of a processor heat sink is optimized. Two objective fu...
[[abstract]]This paper presents a formal systematic optimization process to plate-fins heat sink des...
In this work we illustrate the combined use of the modeFRONTIER optimization system, together with t...
[[abstract]]An effective method for predicting and optimizing the thermal performance of Parallel-Pl...
Fin heat sinks are the most widely used type of heat sink for cooling purposes nowadays where space ...
Forced convective pin-fin heat exchangers, due to the high wet surface area per volume and the hinde...
In this paper topology optimization for cooling by finned heat sinks is studied. To this end, a two-l...
In several research fields, e.g., the miniaturization of electronic components, new solutions for he...
Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooli...
[[abstract]]An effective method for performing the thermal optimization of fully confined pin-fin he...
This work presents an exploration of fluid region optimization within coupled fluid–thermal problems...
Single and multi-objective thermal performance of heat sink are considered using evolutionary optimi...
The thermal management is an ever increasing challenge in advanced electronic devices. In this paper...
Fins and fin arrays with constant temperature at the fin base have known solutions for natural conve...
Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooli...
In this thesis the geometrical configuration of a processor heat sink is optimized. Two objective fu...
[[abstract]]This paper presents a formal systematic optimization process to plate-fins heat sink des...
In this work we illustrate the combined use of the modeFRONTIER optimization system, together with t...
[[abstract]]An effective method for predicting and optimizing the thermal performance of Parallel-Pl...
Fin heat sinks are the most widely used type of heat sink for cooling purposes nowadays where space ...
Forced convective pin-fin heat exchangers, due to the high wet surface area per volume and the hinde...
In this paper topology optimization for cooling by finned heat sinks is studied. To this end, a two-l...
In several research fields, e.g., the miniaturization of electronic components, new solutions for he...
Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooli...
[[abstract]]An effective method for performing the thermal optimization of fully confined pin-fin he...
This work presents an exploration of fluid region optimization within coupled fluid–thermal problems...
Single and multi-objective thermal performance of heat sink are considered using evolutionary optimi...