We report on the heterogeneous integration of electrically pumped InP Fabry-Perot lasers on a SOI photonic integrated circuit by transfer printing. Transfer printing is a promising micromanipulation technique that allows the heterogeneous integration of optical and electronic components realized on their native substrate onto a target substrate with efficient use of the source material, in a way that can be scaled to parallel manipulation and that allows mixing components from different sources onto the same target. We pre-process transfer printable etched facet Fabry-Perot lasers on their native InP substrate, transfer print them into a trench defined in an SOI photonic chip and post-process the printed lasers on the target substrate. The ...
The micro-transfer-printing of prefabricated C-band semiconductor optical amplifiers (SOAs) on a sil...
Separating the substrate allows thin layers of III-V photonic semiconductor materials and devices to...
A transfer printing (TP) method is presented for the micro-assembly of integrated photonic devices f...
We report on the heterogeneous integration of electrically pumped InP Fabry-Perot lasers on a SOI ph...
An electrically pumped DFB laser integrated on and coupled to a silicon waveguide circuit is demonst...
InP-etched facet ridge lasers emitting in the optical C-band are heterogeneously integrated on Si su...
Photonics Integrated Circuits allow optical functionalities and interconnects with small footprint, ...
We report on single-mode C-band distributed feedback lasers fabricated through micro-transfer-printi...
We report on III-V-on-silicon DFB lasers realized by micro-transfer-printing pre-fabricated III-V se...
O-band InP etched facets lasers were heterogeneously integrated by micro-transfer-printing into a 1....
We report on the integration by transfer printing of III-V Fabry-Perot cavities on a silicon photoni...
Transfer printing is an enabling technology for the efficient integration of III-V semiconductor dev...
For the first time, III-V opto-electronic components are coupled to silicon waveguide circuits using...
Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior perfo...
We demonstrate a C-band optical transmitter with an integrated widely-tunable III-V-on-silicon laser...
The micro-transfer-printing of prefabricated C-band semiconductor optical amplifiers (SOAs) on a sil...
Separating the substrate allows thin layers of III-V photonic semiconductor materials and devices to...
A transfer printing (TP) method is presented for the micro-assembly of integrated photonic devices f...
We report on the heterogeneous integration of electrically pumped InP Fabry-Perot lasers on a SOI ph...
An electrically pumped DFB laser integrated on and coupled to a silicon waveguide circuit is demonst...
InP-etched facet ridge lasers emitting in the optical C-band are heterogeneously integrated on Si su...
Photonics Integrated Circuits allow optical functionalities and interconnects with small footprint, ...
We report on single-mode C-band distributed feedback lasers fabricated through micro-transfer-printi...
We report on III-V-on-silicon DFB lasers realized by micro-transfer-printing pre-fabricated III-V se...
O-band InP etched facets lasers were heterogeneously integrated by micro-transfer-printing into a 1....
We report on the integration by transfer printing of III-V Fabry-Perot cavities on a silicon photoni...
Transfer printing is an enabling technology for the efficient integration of III-V semiconductor dev...
For the first time, III-V opto-electronic components are coupled to silicon waveguide circuits using...
Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior perfo...
We demonstrate a C-band optical transmitter with an integrated widely-tunable III-V-on-silicon laser...
The micro-transfer-printing of prefabricated C-band semiconductor optical amplifiers (SOAs) on a sil...
Separating the substrate allows thin layers of III-V photonic semiconductor materials and devices to...
A transfer printing (TP) method is presented for the micro-assembly of integrated photonic devices f...